The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.

The ALD-150LX is Kurt J. Lesker's leading solution for atomic layer deposition (ALD), allowing for the fabrication of uniform thin films at the atomic level. The system integrates proprietary technologies such as the Precursor Focusing Technique™ (PFT) and ultrahigh purity (UHP) processing capabilities, providing high performance and flexibility for the laboratory.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.

The AWB 04 wafer bonding and alignment machine provides a comprehensive adhesive bonding control process in a single chamber (in-situ), achieving superior alignment accuracy of 1 µm and a pressing force of up to 40 kN. The device features high flexibility, a compact design that optimizes space, making it an ideal solution for applications ranging from research and development (R&D) to high-performance production for 3", 4", 6" semiconductor wafers and custom chips.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.

Beneq Transform® is a high-end industrial standard ALD system for mass production in the "More-than-Moore" era. The machine integrates both Thermal ALD and PEALD, flexibly processing semiconductor wafers from 3" to 8" (with a roadmap up to 12"). This is the core thin film solution for Power Electronics (GaN, SiC), RF, MEMS, sensors, MicroLED, and Photonics.

PVA TePla SIRD uses non-destructive infrared scanning technology to map mechanical stress and internal defects in semiconductor wafers (Si, SiC, GaAs) up to 300mm. The device provides superior sensitivity, fast scanning speed, ideal for both R&D research and inline mass production process control.

LuXpector THEA is a high-speed automatic thin film measurement system, combining ellipsometry and reflectometry for superior accuracy. Optimally designed for R&D and mass production, the device measures thickness, refractive index, and layer composition on semiconductor wafers (Si, SiC, GaN, GaAs, etc.) with a processing capability of up to 160 wafers/hour.

VEpioneer® MACRO is a hyperspectral vision inspection system for desktop use, fully integrated and operated with just one button. The device provides non-destructive testing capabilities, identifies surface characteristics, detects thin films, and recognizes deviations from production standards at extremely fast scanning speeds.

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.

The integrated handheld gamma spectroscopy device with HPGe probe, preamplifier, multichannel analyzer, battery, and integrated software provides a relatively compact, portable solution for high-resolution gamma analysis. The "all-in-one" design enhances field usability without the need for any additional external components for setup.

The PGNAA Spectrometer BSI possesses Prompt Gamma Neutron Activation Analysis technology integrated with a high-resolution HPGe detector. The device supports non-destructive analysis and real-time quantification of multi-element components in bulk samples, applicable for in-depth research in various fields..

BSI's Amber-2 features 2 Alpha spectroscopy measurement chambers that can integrate SIID detectors with an active area of up to 1200mm². The device supports simultaneous measurement of 2 samples, with a diameter of up to 50mm, and a customizable distance from the sample to the detector ranging from 4 - 48mm, enabling accurate conversion and analysis of alpha particle energy spectra.

The Alpha amber-12 spectrometer is designed to convert the energy of alpha particles into an electrical signal, which is then amplified, filtered, transformed, collected, and processed to determine the intensity of spectral lines. The desktop version includes 12 measurement chambers, allowing simultaneous analysis of up to 12 samples. Each measurement chamber of the Amber-12 includes an alpha particle measurement head, a pressure sensor, and a signal preamplifier from the alpha measurement head.

The coating thickness analysis device is a tool used to accurately measure the XRF thickness of various types of metal and non-metal coatings (corrosion-resistant, insulating, anti-oxidation, waterproof, pipe coatings, etc.). The substrate/coating composition consists of elements from Mg to U. This system can be applied to control and monitor industrial processes.

TRIO - is a system designed to detect Gamma, Beta, and Alpha radiation, while measuring the activity (specific activity and volumetric activity) of natural radioactive nuclei and artificial radioactive nuclei in water, food, soil samples, radioactive pharmaceuticals, chemical industry materials, and other technology products. Additionally, the device is used to measure the total specific activity of beta and alpha emitting nuclei in water.

The Monolith BSI integrates a Stirling cooler and Active Vibration Cancellation, eliminating the need for liquid nitrogen. The device achieves an energy range of 3keV-10MeV, cooling time <13h, operates at any angle, and recovers instantly after a power outage, optimized for laboratories, fieldwork, and industry.