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[63716-141012-141017-3617151] Ion Beam Etching/Sputtering System Elionix 200ERP New!
Synthesis & Fabrication
Ion Beam Etching/Sputtering System Elionix 200ERP

EIS-200ERP (Elionix Ion Beam Etching/Sputtering System): This is an ion beam etching/sputtering system capable of nano-level material etching and deposition utilizing an ECR (Electron Cyclotron Resonance) ion beam.

 

[1752571374544] Electron Beam Lithography System ELS-ORCA img6576b88ede4dc.jpg
Synthesis & Fabrication
Electron Beam Lithography System ELS-ORCA
ELS-ORCA the application of advanced 30kV EBL Column technology with an upgrade option to 50kV exclusive. The system features an outstanding writing speed of 100 MHz and a Minimum Line Width resolution of up to 10 nm. This is the ideal solution for nano fabrication applications and advanced semiconductor material research and development (R&D).
[1752567035152] ELS-BODEN Electron beam lithography system img6310549954213.png New!
Synthesis & Fabrication
ELS-BODEN Electron beam lithography system

The ELS-BODEN Series is optimized for ultra-fine patterning applications. The device features a writing area of up to 300 mm², flexible from small size samples, 9-inch masks to 300 mm wafers. The operation process is seamlessly automated thanks to the automatic sample loading system. The device provides a flexible range of optional acceleration voltages: 50, 100, 125, and 150 kV.


Tabletop Maskless Aligner µMLA - Heidelberg Instruments µMLA_Dual_Comparment_Micro_Container.webp New!
Maskless and Direct-Write Lithography
Tabletop Maskless Aligner µMLA - Heidelberg Instruments
µMLA is a maskless lithography machine in a benchtop format, highly flexible and customizable. It offers two recording modes: Raster Scan (high speed, excellent image quality) and Vector Scan (optimized for curves, low edge roughness). Variable resolution, supporting up to 3 wavelengths (LED/laser). A compact solution for MEMS research, microfluidics, and micro-optics.
DWL 2000 GS / DWL 4000 - Laser Lithography System dwl-2000-4000_grayscale-lithography.webp
Maskless and Direct-Write Lithography
DWL 2000 GS / DWL 4000 - Laser Lithography System
DWL 2000 GS / 4000 GS meets industrial standards, supports CAD output with 1023 gray levels. The proprietary Grayscale technology from Heidelberg Instruments allows for the creation of 2.5D structures and micro lenses with a surface roughness down to 5nm. An optimal solution for hologram fabrication, light diffusion modules, and Fresnel lenses in optical research and micro-optics.
DWL 66+ Maskless Laser Lithography DWL66_Rings_700nmPitch_xxmW_27_Application-Image.webp
Maskless and Direct-Write Lithography
DWL 66+ Maskless Laser Lithography
The DWL 66+ is a versatile laser lithography machine, the highest resolution in the R&D segment with the smallest size of 200 nm. It supports the creation of 2.5D (grayscale) structures on thick photoresist, with XR writing mode for maximum stability and resolution. Ideal for material research, micro-electronics, and small quantity mask lithography.
MLA 300 Maskless Aligner - Heidelberg Instruments MLA300_Exposures_04.webp
Maskless and Direct-Write Lithography
MLA 300 Maskless Aligner - Heidelberg Instruments
The MLA 300 is optimized for high volume production. The Spatial Light Modulator (SLM) technology allows for distortion correction for each die, automatically focusing on curved surfaces, compatible with SECS/GEM. Completely eliminates the costs and hassles of physical masks. Applications in MEMS production, sensors, ASIC, advanced packaging, power electronics.

ULTRA Semiconductor Mask Writer - Heidelberg Instruments ULTRA-Zerodur-Chuck.webp
Maskless and Direct-Write Lithography
ULTRA Semiconductor Mask Writer - Heidelberg Instruments
ULTRA is a lithography machine using two high-speed SLMs. Layer accuracy of 30 nm, CD uniformity of 30 mm, minimum size of 500 nm. DPSS 355 nm laser reduces operating costs by 80%. Producing masks for semiconductors, easily integrated into the mask production workshop.

VPG 300 DI Maskless Stepper - Heidelberg Instruments AppImg_VPG300DI_VPG400_CMOS-personalization_2-bw.webp
Maskless and Direct-Write Lithography
VPG 300 DI Maskless Stepper - Heidelberg Instruments
The VPG 300 DI is a direct write lithography machine that inherits technology from the VPG (Volume Pattern Generator) line used in mask production. The VPG 300 DI is equipped with a Zerodur table, a differential interferometer, and a DPSS laser at 355 nm. Resolution down to 500 nm, layer 2 alignment (global) achieves 100 nm. Ideal for industrial R&D, small batch production, mix-and-match with a stepper.

NanoFrazor Nanolithography Tool pillars-SEM-image-reversal-process-NanoFrazor.webp
Maskless and Direct-Write Lithography
NanoFrazor Nanolithography Tool
The NanoFrazor is based on Thermal Scanning Probe Lithography (t-SPL), delivering direct, maskless nanopatterning with sub-nanometer precision. Its modular and highly configurable platform combines in-situ imaging, closed-loop lithography, and upgradeable hardware and software options to create complex nanoscale and grayscale structures for cutting-edge research and innovation.

MLA 150 Maskless Aligner - Heidelberg Instruments MLA150_450nm_Lines-and-Spaces.webp
Maskless and Direct-Write Lithography
MLA 150 Maskless Aligner - Heidelberg Instruments
The MLA 150 is a new generation maskless lithography machine, directly projecting digital designs through a spatial light modulator (SLM). The global layer 2 alignment accuracy reaches 500 nm, with a writing speed of up to 1400 mm²/min. Ideal for rapid prototyping, low to medium volume production, and R&D in MEMS, micro-optics, and sensors.

Spin Coater/Developer System N.unixx - Notion System Notion wafer.webp
Lithography
Spin Coater/Developer System N.unixx - Notion System
Coating system n.unixx-series owns exclusive Cover Chuck technology that eliminates the cotton candy effect. The machine meets a maximum Spin Speed of 10,000 rpm, providing an ideal uniform coating and maximizing the savings of Resist. The device is a perfect semi- automatic solution that optimizes Recipe Development for wafer lithography applications up to 300 mm in laboratory and small batch production.
Wafer bonder N.unixx - Notion system Notion wafer.webp
Lithography
Wafer bonder N.unixx - Notion system

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

Wafer debonder N.unixx - Notion system Notion wafer.webp
Lithography
Wafer debonder N.unixx - Notion system

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.

Nanoimprint Lithography NPS300 SET SAS
Nanoimprint Lithography (NIL)
Nanoimprint Lithography NPS300 SET SAS
The NPS300 nano engraving system integrates advanced Nanoimprint Lithography Stepper technology, achieving superior layer alignment accuracy of ± 250 nm and a flexible compression force range. The device provides a high-resolution sub-50 nm engraving solution, optimizing operational costs, ideal for the deep R&D segment and experimental production in optics, biological devices, and nano structures.
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