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11 items found.
Chemical Vapor Deposition (CVD)
Plasma Enhanced Chemical Vapour Deposition Model PlasmaPro 80/100/800

The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

Physical Vapor Deposition (PVD)
Thin Film Deposition System NANO 36
NANO 36 is a highly optimized basic thin film deposition device from Kurt J. Lesker. This device is designed to provide a cost-effective solution while ensuring superior component quality, high performance, and a compact installation area.
Physical Vapor Deposition (PVD)
Thin Film Deposition System AXXIS
AXXIS is a versatile PVD thin film deposition system designed for research and development (R&D) activities that require various coating techniques on the same equipment. The system allows for the combination of Magnetron sputtering, thermal evaporation, and electron beam evaporation while supporting co-deposition to create multi-component films or complex alloys.
Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 200

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 75
The new generation PRO Line PVD 75 thin film deposition system with the capability to handle samples up to 6 inches. The device optimizes ideal base pressure, increases vacuum pumping speed, and supports multiple techniques (Sputtering, E-beam, Thermal). This is a flexible, reliable R&D solution for semiconductor, OLED, and optical technology.
Physical Vapor Deposition (PVD)
UHV Thin Film Deposition System LAB Line

The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

Physical Vapor Deposition (PVD)
Physical Vapor Deposition Batch In-Line KDF

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

Atomic Layer Deposition (ALD)
Atomic Layer Deposition System ALD-150LX

The ALD-150LX is Kurt J. Lesker's leading solution for atomic layer deposition (ALD), allowing for the fabrication of uniform thin films at the atomic level. The system integrates proprietary technologies such as the Precursor Focusing Technique™ (PFT) and ultrahigh purity (UHP) processing capabilities, providing high performance and flexibility for the laboratory.

Atomic Layer Deposition (ALD)
Atomic Layer Deposition TSF200
The Beneq TFS 200 is the most popular atomic layer deposition (ALD) device in academic research and corporate R&D. With its diverse configuration and flexible upgrade capabilities, the system meets all specialized needs of the laboratory. The device supports many advanced applications from protective barrier films, semiconductors, solar cells to superconducting components.
Atomic Layer Deposition (ALD)
Versatile ALD platform Beneq Transform®

Beneq Transform® is a high-end industrial standard ALD system for mass production in the "More-than-Moore" era. The machine integrates both Thermal ALD and PEALD, flexibly processing semiconductor wafers from 3" to 8" (with a roadmap up to 12"). This is the core thin film solution for Power Electronics (GaN, SiC), RF, MEMS, sensors, MicroLED, and Photonics.

Thin Film Deposition
Thin Film Analysis LuXpector THEA

LuXpector THEA is a high-speed automatic thin film measurement system, combining ellipsometry and reflectometry for superior accuracy. Optimally designed for R&D and mass production, the device measures thickness, refractive index, and layer composition on semiconductor wafers (Si, SiC, GaN, GaAs, etc.) with a processing capability of up to 160 wafers/hour.

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