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Cryogenic Systems
Bluefors Cryogenic Wafer Prober
Cryogenic wafer testing system for quantum chips, allowing characterization of quantum devices and superconducting circuits at ultra-low temperatures, supporting research and development of quantum computing technology in a wafer-level environment.
Wafer Inspection & Metrology
Thin film spectrometer for solar cells Helios SCAN-tn
The application of advanced spectroscopic technology, the Helios SCAN-tn coating measurement system provides the ability to analyze the thickness and refractive index of Silicon Nitride thin films at a speed of <0.5s/point. This is a non-contact measurement solution specifically designed for solar cell wafers, helping to optimize the quality control process of anti-reflective (AR) coatings comprehensively.
Wafer Inspection & Metrology
Thin film spectrometer for solar cells Helios-r8
As an advanced Poly-Si coating measurement system, Helios-r8 provides ultra-fast measurement speeds of ≤ 200ms with a thickness accuracy of ±1nm. Based on non-contact optical reflection technology, the device helps control quality and optimize the coating process on TOPCon solar wafer panels, perfectly meeting the requirements for both Inline and Offline analysis.
Wafer Inspection & Metrology
Thin film spectrometer for solar cells Helios-rc
Integrating integral field technology and high-resolution spectrometers, the Helios-rc reflectometer accurately analyzes reflectance, color, and coating thickness at a speed of <100ms. The device is an ideal cost-effective solution for controlling the texturing and etching processes of solar cell wafer surfaces (PERC, TOPCon), optimizing photovoltaic performance.
Wafer Inspection & Metrology
Compact Bench-Top Macro Inspection System VEpioneer® MACRO

VEpioneer® MACRO is a hyperspectral vision inspection system for desktop use, fully integrated and operated with just one button. The device provides non-destructive testing capabilities, identifies surface characteristics, detects thin films, and recognizes deviations from production standards at extremely fast scanning speeds.

Wafer Inspection & Metrology
Inline Inspection System VEreveal® PVA TePla

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.

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