The F&S Bondtec 8650 automatic wire bonding machine features flexible Wedge-Wedge bonding technology for large wires combined with an intelligent image recognition system (PRU). The machine achieves an X/Y travel of up to 700x480 mm with a large force range from 0-1800 cN and integrates CO2 snow cleaning. The device optimizes packaging speed, eliminates manual errors, and is ideal for R&D and the production of hybrid circuits, with average COB output.

With advanced EXLIE ion beam technology, the SIMS AKONIS secondary mass spectrometer achieves a resolution of <1 nm/decade. This is the optimal in-line solution for high-volume semiconductor manufacturing (HVM), enabling measurement of film composition and ion implantation profiles on 20 µm ultra-small pads fully automated without the need for SIMS experts.

The F&S Bondtec Series 90 is groundbreaking with the philosophy of "6 in 1", allowing for quick swapping between automatic wire soldering heads and pull/shear testing on the same platform. The machine features an ultra-wide working area of 480x700mm along with an intelligent PRS image recognition system, optimizing accuracy and processing speed. This solution helps businesses maximize equipment investment costs and flexibly change production models continuously without worrying about memory limitations. Series 90 is the ideal choice for applications in microchip packaging, power semiconductor components, and connecting electric vehicle battery cells.

F&S Bondtec 5350 is a Wedge-Wedge wire bonding machine for large wires 100–500 µm (Al) and 100–300 µm (Cu), supporting ribbons up to 250 µm. The machine uses a motorized Z/Y axis, Voice-Coil bonding force 0–1800 cN, automatic micrometer wire cutting, ultrasonic 58 kHz (optional 40–120 kHz), suitable for R&D, prototyping, and repair with high repeatability.

The 5600Ci wire bonder and pull/shear tester features a proprietary All-in-One design, allowing for flexible switching between automatic pull and shear test heads. The system achieves an accuracy of up to 0.1% and a rapid testing speed of 2 to 3 seconds per wire, driven by an intelligent machine vision system. The equipment optimizes investment costs, supports SPC-compliant data storage, and serves as an ideal solution for COB and hybrid microcircuit applications within the semiconductor industry.

The F&S Bondtec 5310 is a manual wire bonder specialized for processing gold (Au) wires with diameters ranging from 17.5 to 50 µm on 2-inch spools. The system achieves a fine-step resolution of 1 µm, integrates a thermal controller heating up to 250°C, and stores bonding parameters directly to the hard drive. Delivering highly uniform and reproducible bonding results, this equipment is ideal for prototyping, R&D, and microcircuit repair.

The F&S BONDTEC 5610i is a groundbreaking semi-automatic Gold Ball wire bonder fully controlled via PC, bridging the gap between manual and automatic equipment. The system delivers an ultra-high placement accuracy of ±5 µm @ 3 Sigma, an impressive speed of 2 to 3 seconds per wire, and the flexibility to swap bond heads within just 3 minutes. Featuring two versatile operating modes (Single Bond and Multi Wire), the equipment offers outstanding optimization for advanced microcircuit bonding and die repair tasks, while seamlessly converting into a pull/shear tester.

IQM Radiance: Our most powerful on-premise quantum computer with 20, 54, or 150 qubits for high-performance computing (HPC) centers and quantum computing pioneers to use for groundbreaking scientific discoveries and real-world challenges.

SPECS EnviroMETROS is the next generation of XPS surface measurement systems (Surface Hybrid Metrology) that is revolutionary, designed specifically for analyzing the chemical composition in depth of thin films from laboratory scale to semiconductor manufacturing. The system integrates core technology of angle-resolved X-ray photoelectron spectroscopy (ARXPS) that is fully automated, combining flexible multi-source X-ray energy and the ability to operate in a very wide pressure range from ultra-high vacuum (UHV) to near-atmospheric pressure (NAP). This is the optimal solution for analyzing layer structure and material properties without destroying the sample.

Nanonis Tramea™ is a new generation quantum measurement and nano-structure testing system, fully integrating traditional laboratory equipment into a single plug-and-play digital solution. Equipped with proprietary 22-bit hrDAC™ technology and a high-speed real-time FPGA processor, the system allows simultaneous data acquisition of up to 24 channels at an extremely fast rate of 20,000 points/second without compromising signal quality. This groundbreaking solution completely eliminates loop noise and the risk of sample damage due to cable changes, providing optimal signal-to-noise ratio (SNR) performance for quantum transport measurement studies and high-performance investigations.

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

KiloFlow® is a continuous flow reactor for process development & small-scale production. Integrated heat exchangers & a metal free flow path give optimal control for challenging flow chemistry applications. The compact, modular construction of KiloFlow® enables;

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.