With advanced EXLIE ion beam technology, the SIMS AKONIS secondary mass spectrometer achieves a resolution of <1 nm/decade. This is the optimal in-line solution for high-volume semiconductor manufacturing (HVM), enabling measurement of film composition and ion implantation profiles on 20 µm ultra-small pads fully automated without the need for SIMS experts.

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.