The ACCµRA100 uses semi-automatic robotic axis technology, achieving superior post-weld accuracy of ± 0.5 µm and a large pressing force of 1-1000 N. The device provides high repeatability, optimal cost, and is an ideal solution for research (R&D) and diverse applications such as Flip-Chip, Die attach, MEMS, 3D Packaging.

The automatic Ball-Wedge wire bonding machine 5810 F&S Bondtec features a flexible interchangeable bonding head along with an intelligent image recognition system. The device provides a repeatability accuracy of ±3 µm, operates fully automatically without operator dependence to optimize productivity. The product is an ideal solution for R&D applications, pilot manufacturing, and medium-scale production.

The LAB-Tester LT-101 is a compact, streamlined tensile testing machine for welds. The device is equipped with advanced updated software to perform tensile testing easily and quickly. The machine is designed to be versatile, well-suited for both fine wire and large wire applications in the semiconductor packaging industry.

F&S Bondtec 5330 is a Wedge-Wedge wire bonding machine specialized for gold wire, aluminum wire 17.5–75 µm, and ribbon up to 250 µm. Integrated with a Z-axis driven by a linear stepper motor for automatic wire feeding and cutting, ensuring high repeatability of the bond suitable for R&D, prototyping, small-scale production, and microchip repair.

The F&S Bondtec 8650 automatic wire bonding machine features flexible Wedge-Wedge bonding technology for large wires combined with an intelligent image recognition system (PRU). The machine achieves an X/Y travel of up to 700x480 mm with a large force range from 0-1800 cN and integrates CO2 snow cleaning. The device optimizes packaging speed, eliminates manual errors, and is ideal for R&D and the production of hybrid circuits, with average COB output.

The F&S Bondtec Series 90 is groundbreaking with the philosophy of "6 in 1", allowing for quick swapping between automatic wire soldering heads and pull/shear testing on the same platform. The machine features an ultra-wide working area of 480x700mm along with an intelligent PRS image recognition system, optimizing accuracy and processing speed. This solution helps businesses maximize equipment investment costs and flexibly change production models continuously without worrying about memory limitations. Series 90 is the ideal choice for applications in microchip packaging, power semiconductor components, and connecting electric vehicle battery cells.

F&S Bondtec 5350 is a Wedge-Wedge wire bonding machine for large wires 100–500 µm (Al) and 100–300 µm (Cu), supporting ribbons up to 250 µm. The machine uses a motorized Z/Y axis, Voice-Coil bonding force 0–1800 cN, automatic micrometer wire cutting, ultrasonic 58 kHz (optional 40–120 kHz), suitable for R&D, prototyping, and repair with high repeatability.

The 5600Ci wire bonder and pull/shear tester features a proprietary All-in-One design, allowing for flexible switching between automatic pull and shear test heads. The system achieves an accuracy of up to 0.1% and a rapid testing speed of 2 to 3 seconds per wire, driven by an intelligent machine vision system. The equipment optimizes investment costs, supports SPC-compliant data storage, and serves as an ideal solution for COB and hybrid microcircuit applications within the semiconductor industry.

The F&S Bondtec 5310 is a manual wire bonder specialized for processing gold (Au) wires with diameters ranging from 17.5 to 50 µm on 2-inch spools. The system achieves a fine-step resolution of 1 µm, integrates a thermal controller heating up to 250°C, and stores bonding parameters directly to the hard drive. Delivering highly uniform and reproducible bonding results, this equipment is ideal for prototyping, R&D, and microcircuit repair.

The F&S BONDTEC 5610i is a groundbreaking semi-automatic Gold Ball wire bonder fully controlled via PC, bridging the gap between manual and automatic equipment. The system delivers an ultra-high placement accuracy of ±5 µm @ 3 Sigma, an impressive speed of 2 to 3 seconds per wire, and the flexibility to swap bond heads within just 3 minutes. Featuring two versatile operating modes (Single Bond and Multi Wire), the equipment offers outstanding optimization for advanced microcircuit bonding and die repair tasks, while seamlessly converting into a pull/shear tester.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.

PVA TePla SIRD uses non-destructive infrared scanning technology to map mechanical stress and internal defects in semiconductor wafers (Si, SiC, GaAs) up to 300mm. The device provides superior sensitivity, fast scanning speed, ideal for both R&D research and inline mass production process control.

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.