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Automatic Large Area Bond Tester F&S Bondtec 8600C

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Automatic Large Area Bond Tester F&S Bondtec 8600C

The F&S BONDTEC 8600C is a next-generation, PC-controlled automatic bond tester capable of performing fully automated pull and shear tests over a large area. The system supports versatile test heads, including 100 cN, 1,000 cN, and 5,000 cN Pullheads, as well as 500 cN and 5,000 cN Shearheads, catering to a wide range of force spans and bond quality inspection applications within the semiconductor, battery, and solar energy industries.
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  • Field of Study
  • Brand - F&S BONTEC
F&S BONTEC
F&S BONTEC

A multi-functional wire bonding machine manufacturer, allowing bonding and testing on the same machine

Main features


Integrated with various testing heads: Helps flexibly meet all requirements for tensile and shear force testing from micro to large loads.

Large machine table travel: Helps expand the range of automatic testing over large areas such as battery or solar applications.  

Flexible interchangeable testing heads: Allows for quick force range switching to perform various tensile and shear tests.

Measurement accuracy of 0.25% of maximum value: Ensures superior accurate testing results with high reliability.

PC-controlled system with SQL storage: Helps automate the testing process from available programs and perform in-depth statistical analysis such as mean, CPK.

Advanced Force/Time graph measurement feature: Provides additional detailed analytical data about the quality of the tested weld.

Supports multi-format data export (SQL, CSV, HTML): Easily extract reports or transfer data to other database formats for later analysis.

Optional measurement value feedback mechanism: Allows sending measurement data back to the chip-mounted machine and wire welding machine to optimize operational parameters.

Detailed description


Technology & Operating Principles
  • Automatic operation via PC: The machine is fully controlled by a dual-core PC system, allowing for automated testing of an unlimited number of welds from pre-stored programs.

  • Large area testing: The system features a machine table with a very large travel range (X = 700mm, Y = 480 mm, Z = 100mm) with a resolution of 1μm and a repeatability of 5μm, allowing for flexible movement to scan the entire surface of the sample.

  • Accurate measurement mechanism: Utilizes load sensors capable of thermal compensation with calibration data stored directly in the measuring head, ensuring extremely high accuracy of up to 0.25% of the maximum value.

Solving the problem
  • Limitations of inspection area: Conventional testing machines struggle to handle large circuit boards. 8600C effectively addresses this with its wide travel space, perfectly meeting the needs for large-scale applications such as battery or solar energy testing.

  • Lack of evaluation data: Displaying only the maximum destructive force is insufficient for in-depth analysis of failure causes. The machine compensates with advanced measurement features, providing a complete Force/Time graph to better understand the quality of the weld.

  • Repetitive manual operations: Manual alignment on hybrid components or chip-on-board (COB) is very time-consuming. The machine resolves this by automatically repeating measurements through programmed movement of the measuring head combined with a Pattern Recognition Unit (PRU).

Integration & Expansion capabilities
  • Quick swap test head system: The machine uses flexible exchangeable measurement cartridges, allowing for quick switching between force ranges and measurement methods, including pull test heads (Pullheads: 100 cN, 1000 cN, 5000 cN) and shear test heads (Shearheads: 500 cN, 5000 cN).

  • SQL data analysis and synchronization: Integration of an in-depth SQL database for automatic statistical analysis (mean, standard deviation, trends, cpk) and support for exporting multi-format reports such as SQL, CSV, HTML.

  • Expand network connectivity: The device features a GigE-CCD color camera, comprehensive network connectivity via TCP/IP server, while also supporting the option to feedback measurement values back to the die bonder and wire bonder to optimize specifications.

Detailed specifications


ParameterValue
Pull test headPullheads 100 cN, 1000 cN, 5000 cN
Shear test headShearheads 500 cN, 5000 cN
Table travelX = 700 mm, Y = 480 mm, Z = 100 mm
Resolution1 µm
Repeatability5 µm
Axis speedProgrammable from 0.2 to 16 mm/s
Test speed0.2 to 5 mm/s
Measurement accuracy0.25% of maximum value
CalibrationStored in the measuring head, temperature-compensated load sensor
Optional calibrationCan be calibrated at the customer site
Computer systemPC Dual Core, Ethernet, USB 2.0/3.0
CameraGigE-CCD color camera, supports TCP/IP network
Screen22” flat TFT screen
PrinterSupports all Windows-compatible printers


Additional specifications


ParameterValue
ProgrammingAutomatically repeat measurements on hybrid or COB using programmable probe movement and PRU (Pattern Recognition Unit)
EvaluationStatistics including average value, standard deviation, trend, CPK,… based on SQL database
Data exportSQL, CSV, HTML
Other featuresOperator profiles, multiple password levels, optional barcode reader for product identification
Data feedbackCan feedback measurement values to wire bonding machines and chip mounters to optimize parameters (optional)
MicroscopeOlympus stereoscope, other types can be optionally selected
Machine dimensionsHeight ~200 cm, width 130 cm, depth 100 cm
Weight~700 kg
Power supply230 VAC
ConnectionCompressed air 6 bar; vacuum 0.7 bar
Field of Study Materials Sciences or Semiconductor Technology or Solar & Lithium Batteries
Brand F&S BONTEC
DataSheet_8600C_EN.pdf
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Automatic Large Area Bond Tester F&S Bondtec 8600C
Automatic Large Area Bond Tester F&S Bondtec 8600C
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