Main features
Fully PC controlled: Allows unlimited programming of welds and bumps, easily operated automatically through a targeted camera system.
Position accuracy ±5 µm @ 3 Sigma: Ensures thin welds achieve extremely high and uniform accuracy.
Welding speed 2–3 seconds/wire: Enhances performance and optimizes sample processing time.
Quick soldering tip replacement in 3 minutes: Allows flexible switching between thin wire welding, thick wire welding, or tensile/shear testing.
Two operating modes (Single wire and Multi wire): Flexibly meets the needs of manual repair of individual welds to automated mass welding of microchip.
Integrated temperature controller (0–250°C): Supports precise temperature control of the sample placement table, enhancing wire bond quality.
Diverse sample clamping system (Vacuum/Mechanical): Helps securely fix various types of components and sample sizes up to 4 × 4 inches.
Detailed description
F&S BONDTEC 5610i is a groundbreaking semi-automatic gold ball wire bonding machine, fully controlled by a PC, which helps blur the line between manual and automatic equipment.
Digital control: The machine operates through a dual-core PC system running Windows, allowing unlimited programming of welds and bumps.
Semiautomatic mechanism: The user identifies the programmed adjustment points through the targeting camera system (crosshair), and then the machine will automatically perform the welds.
Flexible ultrasonic system: Uses a standard frequency generator of 67 kHz, with an upgrade option to higher frequency ranges of 120, 130, or 140 kHz to optimize wire bond quality.
Technology gap: Manual machines are time-consuming, and fully automatic machines are too expensive. The 5610i addresses this issue by filling the gap with a cost-optimized semi-automatic solution.
Wiring errors in micro soldering: Hand operation can easily damage small components. The machine completely overcomes this issue thanks to its extremely high positional accuracy of ±5 µm (3 Sigma) and the ability to store loop shapes in a library for precise reuse.
Device changeover time: Changing the machine configuration for different types of wires is often very complex. The 5610i addresses this by reducing the setup time to just about 3 minutes.
Integration & Expansion capabilities
Multitasking on a platform: Just change the bonding head and load the corresponding software, the machine can switch from Gold Ball-Bonder to thin wire/thick wire bonding machine (Thin Wire Wedge Wedge/Heavy Wire) or pull/shear testing machine (Pull/Shear Tester).
Integrated hardware: Supports Ethernet, USB 2.0/3.0 connections, color GigE-CMOS camera, and integrated temperature controller from 0–250°C right on the machine.
Expand the workholder: Compatible with various sample clamping systems up to 4 × 4 inches, including vacuum clamps, mechanical clamps, or specialized clamps for TO components.