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Bluefors LH Dilution Refrigerator Measurement Systems LH System 1.webp
Cryogenic Systems
Bluefors LH Dilution Refrigerator Measurement Systems
Bluefors LH is a horizontal dilution refrigerator system, providing a stable milli-Kelvin temperature environment for cryogenic measurement applications and quantum research. The design supports operation at various angles, suitable for cryogenic detectors, beamlines, quantum optics, and ultra-low temperature experiments requiring high stability.
Bluefors XLDHe 1K High Power Measurement System 1K Systems 6.webp
Cryogenic Systems
Bluefors XLDHe 1K High Power Measurement System
Bluefors XLDHehp is a high cooling power 1K cryogenic system, providing a stable low temperature environment for quantum applications and high-performance cryogenic measurements. The system supports large heat loads, high-density wiring, and low noise RF/DC measurements, suitable for spin qubits, cryogenic detectors, and ultra-low temperature research.
Bluefors XLDHesl 1K Measurement Systems XLDHesl 1.webp
Cryogenic Systems
Bluefors XLDHesl 1K Measurement Systems
Bluefors XLDHesl is an integrated 1K side-loading cryogenic system that provides a stable low-temperature environment for quantum applications and high-performance cryogenic research. The side-loading design supports high-density wiring, flexible expansion, and quick replacement of measurement infrastructure for complex quantum experiments.
Bluefors LDHe 1K Measurement System XLDHesl 1.webp
Cryogenic Systems
Bluefors LDHe 1K Measurement System
The 1K cryogenic measurement system using helium is designed for ultra-low temperature experiments in superconducting material research, quantum physics, and quantum devices. An optimal solution for modern R&D laboratories.
Bluefors SDHe 1K Measurement System XLDHesl 3.webp
Cryogenic Systems
Bluefors SDHe 1K Measurement System
The 1K cryogenic measurement system using helium (SDHe), compact design for low temperature experiments in superconducting material research, quantum physics, and quantum technology. A flexible solution for modern R&D laboratories.
Bluefors Cryogenic Wafer Prober Cryogenic Wafer Prober 3.webp
Cryogenic Systems
Bluefors Cryogenic Wafer Prober
Cryogenic wafer testing system for quantum chips, allowing characterization of quantum devices and superconducting circuits at ultra-low temperatures, supporting research and development of quantum computing technology in a wafer-level environment.
MLA 300 Maskless Aligner - Heidelberg Instruments MLA300_Exposures_04.webp
Maskless and Direct-Write Lithography
MLA 300 Maskless Aligner - Heidelberg Instruments
The MLA 300 is optimized for high volume production. The Spatial Light Modulator (SLM) technology allows for distortion correction for each die, automatically focusing on curved surfaces, compatible with SECS/GEM. Completely eliminates the costs and hassles of physical masks. Applications in MEMS production, sensors, ASIC, advanced packaging, power electronics.

ULTRA Semiconductor Mask Writer - Heidelberg Instruments ULTRA-Zerodur-Chuck.webp
Maskless and Direct-Write Lithography
ULTRA Semiconductor Mask Writer - Heidelberg Instruments
ULTRA is a lithography machine using two high-speed SLMs. Layer accuracy of 30 nm, CD uniformity of 30 mm, minimum size of 500 nm. DPSS 355 nm laser reduces operating costs by 80%. Producing masks for semiconductors, easily integrated into the mask production workshop.

UHV Thin Film Deposition System LAB Line Photo-SY-LABLine-Web.webp
Physical Vapor Deposition (PVD)
UHV Thin Film Deposition System LAB Line

The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

VPG 300 DI Maskless Stepper - Heidelberg Instruments AppImg_VPG300DI_VPG400_CMOS-personalization_2-bw.webp
Maskless and Direct-Write Lithography
VPG 300 DI Maskless Stepper - Heidelberg Instruments
The VPG 300 DI is a direct write lithography machine that inherits technology from the VPG (Volume Pattern Generator) line used in mask production. The VPG 300 DI is equipped with a Zerodur table, a differential interferometer, and a DPSS laser at 355 nm. Resolution down to 500 nm, layer 2 alignment (global) achieves 100 nm. Ideal for industrial R&D, small batch production, mix-and-match with a stepper.

Offline thin film spectrometer for OLED Xelas 1e7d77a1-a213-43c4-b0b1-e9ab837e8122.webp
Thin Film Measurement Spectroscopy
Offline thin film spectrometer for OLED Xelas
Owning the proprietary RT-Method spectroscopic technology, the Xelas LAB/SCAN-oled measurement system allows for the determination of thickness (2–500nm) and optical constants (n&k) completely non-contact. This is the ideal measurement solution to help control quality and R&D of thin films in OLED components, organic materials, and ITO electrodes.
Thin film spectrometer for solar cells Helios SCAN-tn 2.webp
Wafer Inspection & Metrology
Thin film spectrometer for solar cells Helios SCAN-tn
The application of advanced spectroscopic technology, the Helios SCAN-tn coating measurement system provides the ability to analyze the thickness and refractive index of Silicon Nitride thin films at a speed of <0.5s/point. This is a non-contact measurement solution specifically designed for solar cell wafers, helping to optimize the quality control process of anti-reflective (AR) coatings comprehensively.
Gap monitoring camera for Cz furnace ETA-SiCAM siapp.webp
Synthesis & Fabrication
Gap monitoring camera for Cz furnace ETA-SiCAM

The ETA-SiCAM gap distance measurement device features a patented optical design, providing accuracy <0.5mm and a measurement speed of 5Hz. This is the optimal solution for maintaining stable thermodynamic control in Czochralski crystal pullers (Cz), enhancing the quality of Silicon ingots for solar cells and semiconductor components.

Multi-purpose spectroscopic camera TCM uScope 1.webp
Thin Film Measurement Spectroscopy
Multi-purpose spectroscopic camera TCM uScope
As an advanced micro-spectroscopy measurement system, the TCM µScope (NXT) integrates a specialized microscopic measurement head with an extremely small measurement spot size down to 5µm. The device accurately analyzes thin film thickness (2nm - 25µm), optical constants, and color. This is the optimal measurement solution for the semiconductor industry, flat panel display (FPD) manufacturing, and material coating.
Thin film spectrometer for Lithium batteries TCM R-NIR lit-lab.webp
Thin Film Measurement Spectroscopy
Thin film spectrometer for Lithium batteries TCM R-NIR
With advanced non-contact spectral technology, NXT's TCM thin film thickness measurement system provides ultra-fast measurement speeds of ≤ 2ms with an accuracy resolution of ± 0.1 µm. This is the most cost-effective and reliable solution for monitoring the quality (QC) of dielectric films in Lithium battery production, helping to detect inline deviations early, optimize materials, and completely eliminate the risk of battery short circuits.
Offline multi-purpose reflectance and thickness spectrometer ETA-SST image2.webp
Thin Film Measurement Spectroscopy
Offline multi-purpose reflectance and thickness spectrometer ETA-SST
The ETA-SST reflectance spectrometer system from NXT utilizes linear array sensor technology, measuring the range of 380-1700 nm. The device achieves optical resolution of up to 3.3 nm, enabling accurate measurement of single/double layer thickness (0.1–30 µm). With a compact design, this is an optimized productivity solution for R&D and QA/QC of semiconductor components, optical glass, and packaging.
Offline multi-purpose transmittance and color spectrometer ETA-CSS image2.webp
Thin Film Measurement Spectroscopy
Offline multi-purpose transmittance and color spectrometer ETA-CSS
The ETA-CSS laboratory optical transmission and color measurement system from NXT uses advanced spectral technology, providing chromaticity xyY accuracy of ±0.002. This is an optimal cost-effective solution for controlling the quality of thin films, filters, and optical glass, supporting enhanced production efficiency through a simple operating process.
Thin film spectrometer for ophthalmic lenses ETA-ARC image4.webp
Thin Film Measurement Spectroscopy
Thin film spectrometer for ophthalmic lenses ETA-ARC
With proprietary back reflection cancellation technology, NXT's ETA-ARC lens coating measurement system is the optimal solution for quality inspection of eyewear. The device quickly measures excess reflection, color, and thickness of hard coatings (0.1–20 µm) in less than 0.2 seconds without the need for roughening or black coating the back, helping to preserve the integrity of the sample being measured.
Inline multi-purpose spectrometer ETA-TCM image3.webp
Thin Film Measurement Spectroscopy
Inline multi-purpose spectrometer ETA-TCM

The inline spectrometer system ETA-TCM from NXT provides a 100% non-destructive thin film quality control solution directly on the production line. The device supports simultaneous measurement of thickness (0.1–30 µm), color, transmittance, reflectance, and optical density (OD1–OD7). This is the optimal solution to save materials and enhance productivity for the screen, glass, and semiconductor industries.

Thin film spectrometer for large format glass Metis
Thin Film Measurement Spectroscopy
Thin film spectrometer for large format glass Metis
The integrated smart integrating sphere, the Metis optical thin film measurement system from NXT provides superior thin film quality control capabilities thanks to a wide measurement spectrum range of 380–1070nm and an extremely fast speed of <0.1 seconds/point. This is the optimal cost-effective solution for measuring reflectance, transmittance, film thickness, and n&k constants on roll-to-roll films and large glass.
Thin Wire Wedge-Wedge Bonder F&S Bondtec 5330 FS Bondtec_5310_2.webp
Advanced Packaging & Testing
Thin Wire Wedge-Wedge Bonder F&S Bondtec 5330

F&S Bondtec 5330 is a Wedge-Wedge wire bonding machine specialized for gold wire, aluminum wire 17.5–75 µm, and ribbon up to 250 µm. Integrated with a Z-axis driven by a linear stepper motor for automatic wire feeding and cutting, ensuring high repeatability of the bond suitable for R&D, prototyping, small-scale production, and microchip repair.

 

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