The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

F&S Bondtec 5330 is a Wedge-Wedge wire bonding machine specialized for gold wire, aluminum wire 17.5–75 µm, and ribbon up to 250 µm. Integrated with a Z-axis driven by a linear stepper motor for automatic wire feeding and cutting, ensuring high repeatability of the bond suitable for R&D, prototyping, small-scale production, and microchip repair.

The F&S Bondtec 8650 automatic wire bonding machine features flexible Wedge-Wedge bonding technology for large wires combined with an intelligent image recognition system (PRU). The machine achieves an X/Y travel of up to 700x480 mm with a large force range from 0-1800 cN and integrates CO2 snow cleaning. The device optimizes packaging speed, eliminates manual errors, and is ideal for R&D and the production of hybrid circuits, with average COB output.

With advanced EXLIE ion beam technology, the SIMS AKONIS secondary mass spectrometer achieves a resolution of <1 nm/decade. This is the optimal in-line solution for high-volume semiconductor manufacturing (HVM), enabling measurement of film composition and ion implantation profiles on 20 µm ultra-small pads fully automated without the need for SIMS experts.

The F&S Bondtec Series 90 is groundbreaking with the philosophy of "6 in 1", allowing for quick swapping between automatic wire soldering heads and pull/shear testing on the same platform. The machine features an ultra-wide working area of 480x700mm along with an intelligent PRS image recognition system, optimizing accuracy and processing speed. This solution helps businesses maximize equipment investment costs and flexibly change production models continuously without worrying about memory limitations. Series 90 is the ideal choice for applications in microchip packaging, power semiconductor components, and connecting electric vehicle battery cells.

F&S Bondtec 5350 is a Wedge-Wedge wire bonding machine for large wires 100–500 µm (Al) and 100–300 µm (Cu), supporting ribbons up to 250 µm. The machine uses a motorized Z/Y axis, Voice-Coil bonding force 0–1800 cN, automatic micrometer wire cutting, ultrasonic 58 kHz (optional 40–120 kHz), suitable for R&D, prototyping, and repair with high repeatability.

The 5600Ci wire bonder and pull/shear tester features a proprietary All-in-One design, allowing for flexible switching between automatic pull and shear test heads. The system achieves an accuracy of up to 0.1% and a rapid testing speed of 2 to 3 seconds per wire, driven by an intelligent machine vision system. The equipment optimizes investment costs, supports SPC-compliant data storage, and serves as an ideal solution for COB and hybrid microcircuit applications within the semiconductor industry.

The F&S Bondtec 5310 is a manual wire bonder specialized for processing gold (Au) wires with diameters ranging from 17.5 to 50 µm on 2-inch spools. The system achieves a fine-step resolution of 1 µm, integrates a thermal controller heating up to 250°C, and stores bonding parameters directly to the hard drive. Delivering highly uniform and reproducible bonding results, this equipment is ideal for prototyping, R&D, and microcircuit repair.

The F&S BONDTEC 5610i is a groundbreaking semi-automatic Gold Ball wire bonder fully controlled via PC, bridging the gap between manual and automatic equipment. The system delivers an ultra-high placement accuracy of ±5 µm @ 3 Sigma, an impressive speed of 2 to 3 seconds per wire, and the flexibility to swap bond heads within just 3 minutes. Featuring two versatile operating modes (Single Bond and Multi Wire), the equipment offers outstanding optimization for advanced microcircuit bonding and die repair tasks, while seamlessly converting into a pull/shear tester.

SPECS EnviroMETROS is the next generation of XPS surface measurement systems (Surface Hybrid Metrology) that is revolutionary, designed specifically for analyzing the chemical composition in depth of thin films from laboratory scale to semiconductor manufacturing. The system integrates core technology of angle-resolved X-ray photoelectron spectroscopy (ARXPS) that is fully automated, combining flexible multi-source X-ray energy and the ability to operate in a very wide pressure range from ultra-high vacuum (UHV) to near-atmospheric pressure (NAP). This is the optimal solution for analyzing layer structure and material properties without destroying the sample.