EIS-200ERP (Elionix Ion Beam Etching/Sputtering System): This is an ion beam etching/sputtering system capable of nano-level material etching and deposition utilizing an ECR (Electron Cyclotron Resonance) ion beam.

The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

The ELS-BODEN Series is optimized for ultra-fine patterning applications. The device features a writing area of up to 300 mm², flexible from small size samples, 9-inch masks to 300 mm wafers. The operation process is seamlessly automated thanks to the automatic sample loading system. The device provides a flexible range of optional acceleration voltages: 50, 100, 125, and 150 kV.

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.