Main features
- High-speed optical engine – inherited from the VPG line in mask shops worldwide
- Two high-resolution recording modes – minimum size 500 nm (Mode I) and 800 nm (Mode II)
- Precise alignment – layer 2 alignment, distortion compensation, alignment per die, 2D Stage Map Correction calibration
- High-power DPSS laser – wavelength 355 nm, for i-line optical barriers
- Strict environmental control – temperature-controlled sealed chamber, environmental variation compensation via software
- Automatic wafer processing options – automatic loading and prealign for wafers 100, 150, 200, 300 mm; front and back alignment (VIS/IR)
Detailed description
Technology & principles
The VPG 300 DI combines with the Zerodur table and differential interferometer to achieve extremely high positional accuracy and stacking. The real-time automatic focusing system has a compensation range of >160 μm. The software easily converts standard design formats (CAD), supports data calibration, optimizes patterns, and assembles masks.
Limitations of traditional lithography
- R&D applications require very high overlay accuracy.
- Difficult to integrate between direct write laser and other tools (stepper, e-beam) due to alignment discrepancies.
- Wafer deformation and changes in the environment affect overlay.
Advantages of the VPG 300 DI maskless lithography system
- VPG 300 DI provides high overlay accuracy thanks to the Zerodur table, interferometer, and Stage Map Correction calibration.
- The mix-and-match alignment feature allows integration with the stepper.
- A tightly controlled environmental monitoring system, software compensation based on precise measurements.
Integration & expansion
- The integrated camera and software system allows for measurement and alignment.
- Fully automated processing options for 100–300 mm wafers, back-side IR/Vis alignment.