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ULTRA Maskless Aligner - Heidelberg Instruments

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MLA 300 Maskless Aligner - Heidelberg Instruments
MLA 300 Maskless Aligner - Heidelberg Instruments
UHV Thin Film Deposition System LAB Line
UHV Thin Film Deposition System LAB Line

ULTRA Maskless Aligner - Heidelberg Instruments

ULTRA is a lithography machine using two high-speed SLMs. Layer accuracy of 30 nm, CD uniformity of 30 mm, minimum size of 500 nm. DPSS 355 nm laser reduces operating costs by 80%. Producing masks for semiconductors, easily integrated into the mask production workshop.

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  • Field of Study
  • Brand - Heidelberg
  • Sample materials
Heidelberg
Heidelberg

The world's number 1 manufacturer of maskless lithography products (Markless Lithography) for R&D and production

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Main features


  • Two high-power SLMs, layout fine-tuned for optimal throughput and image quality
  • Two writing modes: QX (quality) – 325 mm²/min, FX (fast) – 580 mm²/min
  • CD uniformity of 30 mm, SLM intensity adjustment automatically with an accuracy of 2%
  • Overlay of 30 nm thanks to a differential interferometer of 1.2 nm, Zerodur table, temperature stable ±0.02 K
  • Second layer alignment achieving 100 nm – critical for phase shift masks (PSM)
  • Custom-designed lens, NA 0.9, address grid 4 nm, optimized for wavelengths 355 nm and 640 nm
  • DPSS 355 nm laser, lifespan of 20,000 hours, costs 80% less than gas lasers

Detailed description


Technology & principle

ULTRA uses two spatial light modulators (SLM) operating in parallel, directly illuminating the mask from digital data. High-speed data transmission processes complex geometries. The machine table uses linear motors and air bearings. The autofocus system through the main lens.

Limitations of traditional lithography

  • Gas lasers (Kr+, Ar+) consume a lot of power, high replacement costs.
  • Difficult to achieve accurate overlay and alignment for PSM masks due to substrate deformation.
  • CD is uneven with a high density structure.

Advantages of the ULTRA maskless lithography system 

  • Two SLMs in parallel + high-speed transmission → significantly reduced exposure time.
  • DPSS 355 nm laser saves 80% costs, lifespan of 20,000 hours.
  • Zerodur table + interferometer 1.2 nm + temperature-controlled cabinet ±0.02K → 30 nm overlay.
  • Matrix distortion correction algorithm → second layer alignment 100 nm.
  • NA 0.9 lens, pure diffraction limit → 30 mm uniform CD.

Integration & expansion

Compatible with all i‑line optical barriers (355 nm), integrated flowbox. Zerodur chuck with 3-point support, high repeatability. Easy installation into mask production workshop.

Detailed specifications


Specifications

Value

Maximum engraving area

228 x 228 mm2

Layer stack (Overlay)

30 nm

Maximum alignment error of the second layer

100 nm

CD uniformity

30 mm

Engraving speed – QX / FX

325 / 580 mm²/min

Mask engraving time 6″×6″

75 ph (QX), 45 ph (FX)

Light source

DPSS Laser 355 nm (and 640 nm for camera)


Field of Study Materials Sciences or Semiconductor Technology or Quantum Technology
Brand Heidelberg
Sample materials Advanced Materials
ULTRA_Brochure.pdf
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ULTRA Maskless Aligner - Heidelberg Instruments
ULTRA Maskless Aligner - Heidelberg Instruments
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