Key Features
The most trusted ALD research platform (Most Trusted Platform): There are currently over 250 TFS 200 systems operating at nearly 150 universities and research institutes, contributing to hundreds of scientific papers and breakthrough results.
Highly customizable (Highly Customizable): Easy to configure the processing chamber according to laboratory needs, including direct or remote plasma options, small batch processing chambers, along with various gas line paths and diverse power supplies.
Easy integration (Easy Integration): Convenient for connecting to existing production lines or multi-chamber cluster systems. The machine can be equipped with additional auxiliary tools such as glove boxes or load locks to enhance flexibility and automation.
Wide and stable temperature range (Wide Temperature Range): Supports optimal temperature processing from 25°C to 500°C, well-suited for many types of materials and thermally sensitive processes.
Diverse substrate handling (Diverse Substrate Handling): Not only does it handle large round/square wafers up to 200 mm, but the system also effectively processes wafer batches, 3D components, particulate forms, as well as porous structures and high aspect ratio structures.
Detailed description
Technology & Operating Principle
The Beneq TFS 200 operates based on advanced Atomic Layer Deposition (ALD) technology, supporting both core processing methods: Thermal ALD and Plasma-Enhanced ALD. The device allows for the deposition of high-quality thin films such as Al₂O₃ for barrier layer applications; HfO₂, SiO₂, and SiN for semiconductor applications; SnO for photovoltaic cells (solar cells); along with TiN and NbN for superconducting applications.
R&D laboratories often face challenges when research demands change continuously but budgets are limited, making it difficult to continuously replace expensive ALD systems. The TFS 200 effectively addresses this barrier with its open modular design, providing a flexible platform capable of "growing with you." The ability to flexibly upgrade from Thermal ALD to Plasma ALD, add gas lines, or integrate additional glove box/load lock allows researchers to quickly transition applications without needing to reinvest in the entire system.
Integration & Expansion
The TFS 200 platform features flexible integration capabilities under various configurations: Stand-alone, Cluster, integrated Glovebox, or Loadlock. The machine flexibly supports substrate types from round wafers up to Ø 200 mm, square wafers up to 200x200 mm, to particulate structures or porous structures with complex surface depths.