The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.

The AWB 04 wafer bonding and alignment machine provides a comprehensive adhesive bonding control process in a single chamber (in-situ), achieving superior alignment accuracy of 1 µm and a pressing force of up to 40 kN. The device features high flexibility, a compact design that optimizes space, making it an ideal solution for applications ranging from research and development (R&D) to high-performance production for 3", 4", 6" semiconductor wafers and custom chips.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.

Beneq Transform® is a high-end industrial standard ALD system for mass production in the "More-than-Moore" era. The machine integrates both Thermal ALD and PEALD, flexibly processing semiconductor wafers from 3" to 8" (with a roadmap up to 12"). This is the core thin film solution for Power Electronics (GaN, SiC), RF, MEMS, sensors, MicroLED, and Photonics.

PVA TePla SIRD uses non-destructive infrared scanning technology to map mechanical stress and internal defects in semiconductor wafers (Si, SiC, GaAs) up to 300mm. The device provides superior sensitivity, fast scanning speed, ideal for both R&D research and inline mass production process control.

LuXpector THEA is a high-speed automatic thin film measurement system, combining ellipsometry and reflectometry for superior accuracy. Optimally designed for R&D and mass production, the device measures thickness, refractive index, and layer composition on semiconductor wafers (Si, SiC, GaN, GaAs, etc.) with a processing capability of up to 160 wafers/hour.

VEpioneer® MACRO is a hyperspectral vision inspection system for desktop use, fully integrated and operated with just one button. The device provides non-destructive testing capabilities, identifies surface characteristics, detects thin films, and recognizes deviations from production standards at extremely fast scanning speeds.

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.