The ETA-SiCAM gap distance measurement device features a patented optical design, providing accuracy <0.5mm and a measurement speed of 5Hz. This is the optimal solution for maintaining stable thermodynamic control in Czochralski crystal pullers (Cz), enhancing the quality of Silicon ingots for solar cells and semiconductor components.

F&S Bondtec 5330 is a Wedge-Wedge wire bonding machine specialized for gold wire, aluminum wire 17.5–75 µm, and ribbon up to 250 µm. Integrated with a Z-axis driven by a linear stepper motor for automatic wire feeding and cutting, ensuring high repeatability of the bond suitable for R&D, prototyping, small-scale production, and microchip repair.

The F&S Bondtec 8650 automatic wire bonding machine features flexible Wedge-Wedge bonding technology for large wires combined with an intelligent image recognition system (PRU). The machine achieves an X/Y travel of up to 700x480 mm with a large force range from 0-1800 cN and integrates CO2 snow cleaning. The device optimizes packaging speed, eliminates manual errors, and is ideal for R&D and the production of hybrid circuits, with average COB output.

The F&S Bondtec Series 90 is groundbreaking with the philosophy of "6 in 1", allowing for quick swapping between automatic wire soldering heads and pull/shear testing on the same platform. The machine features an ultra-wide working area of 480x700mm along with an intelligent PRS image recognition system, optimizing accuracy and processing speed. This solution helps businesses maximize equipment investment costs and flexibly change production models continuously without worrying about memory limitations. Series 90 is the ideal choice for applications in microchip packaging, power semiconductor components, and connecting electric vehicle battery cells.

F&S Bondtec 5350 is a Wedge-Wedge wire bonding machine for large wires 100–500 µm (Al) and 100–300 µm (Cu), supporting ribbons up to 250 µm. The machine uses a motorized Z/Y axis, Voice-Coil bonding force 0–1800 cN, automatic micrometer wire cutting, ultrasonic 58 kHz (optional 40–120 kHz), suitable for R&D, prototyping, and repair with high repeatability.

The 5600Ci wire bonder and pull/shear tester features a proprietary All-in-One design, allowing for flexible switching between automatic pull and shear test heads. The system achieves an accuracy of up to 0.1% and a rapid testing speed of 2 to 3 seconds per wire, driven by an intelligent machine vision system. The equipment optimizes investment costs, supports SPC-compliant data storage, and serves as an ideal solution for COB and hybrid microcircuit applications within the semiconductor industry.

The F&S Bondtec 5310 is a manual wire bonder specialized for processing gold (Au) wires with diameters ranging from 17.5 to 50 µm on 2-inch spools. The system achieves a fine-step resolution of 1 µm, integrates a thermal controller heating up to 250°C, and stores bonding parameters directly to the hard drive. Delivering highly uniform and reproducible bonding results, this equipment is ideal for prototyping, R&D, and microcircuit repair.

The F&S BONDTEC 5610i is a groundbreaking semi-automatic Gold Ball wire bonder fully controlled via PC, bridging the gap between manual and automatic equipment. The system delivers an ultra-high placement accuracy of ±5 µm @ 3 Sigma, an impressive speed of 2 to 3 seconds per wire, and the flexibility to swap bond heads within just 3 minutes. Featuring two versatile operating modes (Single Bond and Multi Wire), the equipment offers outstanding optimization for advanced microcircuit bonding and die repair tasks, while seamlessly converting into a pull/shear tester.

IQM Radiance: Our most powerful on-premise quantum computer with 20, 54, or 150 qubits for high-performance computing (HPC) centers and quantum computing pioneers to use for groundbreaking scientific discoveries and real-world challenges.

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.

The ALD-150LX is Kurt J. Lesker's leading solution for atomic layer deposition (ALD), allowing for the fabrication of uniform thin films at the atomic level. The system integrates proprietary technologies such as the Precursor Focusing Technique™ (PFT) and ultrahigh purity (UHP) processing capabilities, providing high performance and flexibility for the laboratory.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.