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Maskless Laser Lithography DWL 2000 GS / DWL 4000 GS

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Tabletop Maskless Aligner µMLA - Heidelberg Instruments
Tabletop Maskless Aligner µMLA - Heidelberg Instruments
Bluefors LD Dilution Refrigerator Systems
Bluefors LD Dilution Refrigerator Systems

Maskless Laser Lithography DWL 2000 GS / DWL 4000 GS

DWL 2000 GS / 4000 GS meets industrial standards, supports CAD output with 1023 gray levels. The proprietary Grayscale technology from Heidelberg Instruments allows for the creation of 2.5D structures and micro lenses with a surface roughness down to 5nm. An optimal solution for hologram fabrication, light diffusion modules, and Fresnel lenses in optical research and micro-optics.
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  • Field of Study
  • Brand - Heidelberg
  • Sample materials
Heidelberg
Heidelberg

The world's number 1 manufacturer of maskless lithography products (Markless Lithography) for R&D and production

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Main features


  • Fixed optical system, automatic real-time focusing, high-end static gas table
  • High-resolution interferometer continuously monitors table position
  • Advanced climate control, temperature stability ±0.1°C, ISO 4 environment
  • Integrated CCD camera and overall camera for easy alignment
  • Supports 4 write modes to optimize performance for each application
  • Creates complex structures from CAD files (DXF, BMP, STL, X,Y,Z-ASCII) up to 1023 gray levels
  • Comprehensive software: manipulates and combines CAD files, creates complex patterns, optimizes structures

Detailed description


Technology & principles

DWL 2000 GS / 4000 GS – Grayscale laser lithography system, using 1023 gray levels (unlike traditional binary lithography). 3D CAD data → directly maps laser intensity → creates continuous 2.5D structures (micro lenses, blazed gratings) in just one step.

Limitations of traditional lithography

  • Binary lithography requires multiple masks + multiple overlapping etching steps, prone to alignment errors.
  • With micro lens lens/hologram, the old method takes weeks due to design, mask fabrication, and multiple alignments.
  • The cost of chrome masks is very high, especially when many masks are needed for complex structures.
  • Lack of direct conversion software 3D CAD → laser signal, causing geometric distortion.

Ưu điểm của hệ thống DWL 2000 GS / 4000 GS

  • A single step grayscale process - saves costs and mask production time, faster than e-beam lithography. Smooth surface (roughness 5nm). Software imports STL/DXF/BMP, automatic mapping; supports GenISys BEAMER.
Integration/expansion

Combines profilometer, microscope; compatible with optical barriers AZ 1500, AZ 4562; easy to integrate into clean rooms.

Technical specifications


Parameter

Value

Maximum exposure area

200 × 200 mm² (2000 GS), 400 × 400 mm² (4000 GS)

Layering accuracy (3σ, over 8"x8")

300 nm

Writing speed (maximum)

1250 mm²/min

Maximum throughput

5600 mJ/cm² (mode I)

Automatic focus compensation range

80 μm

Light source

Laser diode, 405 nm

Base thickness

0 – 12 mm

Field of Study Materials Sciences or Semiconductor Technology
Brand Heidelberg
Sample materials Advanced Materials
Fact-sheet DWL 2000 GS DWL 4000 GS.pdf
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Maskless Laser Lithography DWL 2000 GS / DWL 4000 GS
Maskless Laser Lithography DWL 2000 GS / DWL 4000 GS
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