Main features
- Safe thermal slide separation technology (Thermal Slide Separation): Supports a separation mechanism with adjustable force, helping to protect the structure of ultra-thin wafers from cracking or mechanical deformation.
- Integrated dual heating system (Embedded Heaters): Equipped with two independent heating units directly distributed on both the wafer plate (Wafer Plate) and the temporary carrier plate (Carrier Plate), with an adjustable temperature range up to $200^{\circ}\text{C}$.
- Outstanding temperature uniformity: Maintains exceptional thermal uniformity at +/- 0.5oC across the entire processing surface, ensuring that the bonding adhesive is evenly softened perfectly.
- Protective vacuum line (Adjustable Vacuum Line): Integrates a vacuum negative pressure line with adjustable pressure capabilities, helping to securely hold and fix fragile/sensitive wafers throughout the separation process.
- Diverse material compatibility: Optimal operation and perfect compatibility with various types of industrial substrates including Silicon, compound semiconductor materials (Compound Semiconductors), and glass (Glass).
Detailed description
Technology/Principle:
The n.unixx-series debonding system operates based on the principle of thermal slide debonding for single wafer plates. The assembly structure consists of a thin wafer bonded to a temporary carrier placed between the wafer holder and the carrier holder. The system activates embedded heaters to raise the temperature of the adhesive layer to the desired melting point (up to $200^{\circ}\text{C}$). Once the adhesive softens, a precisely controlled mechanical lateral sliding force gently separates the wafer from the carrier while the vacuum system continuously holds it in place to protect the sample.
Highlights:
In advanced semiconductor packaging processes, thinning the wafer is mandatory, making the wafer extremely fragile and brittle. When separating the wafer from the temporary carrier after processing, manual or uneven forced separation methods can easily cause cracking, edge curling, or complete destruction of the microchip. The n.unixx-series system thoroughly addresses this "pain" by combining adjustable sliding force and specialized protective vacuum paths. The separation process occurs uniformly in terms of kinematics and thermodynamics, eliminating local mechanical stresses on the thin wafer.
Integration/Expansion:
The product features a compact semi-automated modular structure, equipped with an independent temperature controller. The device is easy to install seamlessly in a laboratory space or small-scale production workshop meeting ISO Class 4 standards, perfectly connecting with the chemical cleaning process after debonding to create a complete workflow.