Main features
- Uniform thermal-pressure bonding technology: Optimizes surface bonding quality through the precise combination of mechanical pressure and uniform heat distribution.
- High precision temperature control: Integrates an intelligent Temperature Controller that supports step-by-step settings of 1°C, maintaining superior temperature uniformity at +/- 0.5oC.
- Durable sample mounting system: The wafer plate is made from micro-polished stainless steel and high-grade anodized aluminum, resistant to wear and optimally dispersing heat.
- Exclusive bonding film protection mechanism: Equipped with an integrated specialized Protection Foil, preventing mechanical damage and surface contamination of the wafer during the thermal pressing process.
- Safe semi-automatic operation: Simple and safe manual loading/unloading design, protected by a powder-coated steel frame that meets ISO Class 4 cleanroom standards.
Detailed description
Technology/Principle:
- The n.unixx-series Wafer bonding device operates based on the principle of simultaneous mechanical-thermal bonding (Thermo-compression Bonding) for single wafer plate structures. The wafer, after alignment, is placed on the wafer stage (Wafer Plate). The system uses a mechanical pressure unit (Pressure Unit) to tightly press the substrate layers together through a protective film (Protection Foil), combined with an integrated heating unit with independent control to activate the chemical bonds or adhesive layer between the two surfaces at high temperatures.
Highlights:
- In manual wafer bonding processes or using homemade devices, the lack of uniformity in temperature and localized pressure is the main cause of voids, misalignment of microstructure layers, or cracking of expensive thin wafer layers. The n.unixx-series bonding device completely addresses this "pain" by integrating a high-precision temperature control unit achieving a deviation of only +/-0.5°C across the entire surface of the stage, combined with a pressure distribution cushion to ensure maximum successful bonding conversion.
Integration/Expansion:
- Part of the n.unixx-series ecosystem, this wafer bonding device features a compact and independent modular design, allowing it to fit snugly in lab fume hoods. The device easily integrates into the photolithography process along with the optical coating module (Coater) and the developing module (Developer) from Notion to create a flexible, closed-loop microstructure processing line.