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Semiconductor Technology
Fundamental Research Equipment
Glove Box PureEvo
The PureEvo Series glove box system is a high-end, fully customizable configuration (Premium and Fully Customizable) from Jacomex, integrating a high-performance independent Core-12 clean air unit. The device is designed and optimized without limits to perfectly adapt to any complex or specific processes in advanced scientific research and high-tech industry.
Fundamental Research Equipment
Glove Box Jacomex G(Box)
The G(BOX) Series glove box system is part of the modular equipment segment for pressure and humidity control (Modular Glove Box under Regulated Atmosphere) from Jacomex, designed specifically for scientific and industrial applications. The device features a flexible structure, easy to configure and upgrade, providing optimal product protection solutions in environments with controlled humidity or reduced oxygen atmosphere to prevent explosions.
Fundamental Research Equipment
Glovebox Jacomex G(Safe)
The G(Safe) Series glove box system belongs to the high safety protective equipment segment operating in a negative pressure filtered air environment (High Security Glove Box under Negative Pressure Filtered Air) from Jacomex, designed specifically for applications in nuclear research, radiation, and critical industry. The equipment provides a solution for isolation, comprehensively protecting the operator and the environment from harmful agents, radiation, or high biological contamination risks.
Electron Microscopy (SEM & TEM)
High Speed Scanning Electron Microscope HEM6000

CIQTEK HEM6000 integrates technologies such as a high-brightness electron gun with a large beam current, a high-speed electron beam deflection system, and a high voltage sample deceleration mechanism. The device accelerates the speed of large-scale nano structure imaging up to 5 times faster than conventional FESEM, providing a perfect large-scale 3D reconstruction solution for the semiconductor and biological industries (biological 3D reconstruction).

Maskless Laser Lithography (MLA)
DWL 66+ Maskless Laser Lithography
The DWL 66+ is a versatile laser lithography machine, the highest resolution in the R&D segment with the smallest size of 200 nm. It supports the creation of 2.5D (grayscale) structures on thick photoresist, with XR writing mode for maximum stability and resolution. Ideal for material research, micro-electronics, and small quantity mask lithography.
Cryogenic Systems
Bluefors XLDsl Dilution Refrigerator Measurement Systems
The XLDsl Dilution Refrigerator Measurement System is a cryogenic dilution refrigerator designed for research and quantum computing applications, providing a stable cryogenic environment at milli-Kelvin levels to operate superconducting qubits, while integrating precise measurement capabilities for experiments and the development of quantum technology.
Cryogenic Systems
Bluefors SD Dilution Refrigerator Measurement Systems
The Bluefors SD Dilution Refrigerator Measurement System provides a stable cryogenic milli-Kelvin environment for quantum computing research, supporting superconducting qubits and quantum measurements with high accuracy.
Cryogenic Systems
Bluefors Ultra-Compact LD Dilution Refrigerator Measurement Systems
The Ultra-Compact LD helium dilution refrigerator system from Bluefors is a high-end integrated cryogenic solution, allowing for temperatures down to milli-Kelvin in a super compact design. The device combines a cryostat, measurement system, and control infrastructure in a synchronized platform, optimized for low-temperature physics research, quantum computing, and experiments requiring extremely high stability in confined spaces.
Cryogenic Systems
Bluefors LH Dilution Refrigerator Measurement Systems
Bluefors LH is a horizontal dilution refrigerator system, providing a stable milli-Kelvin temperature environment for cryogenic measurement applications and quantum research. The design supports operation at various angles, suitable for cryogenic detectors, beamlines, quantum optics, and ultra-low temperature experiments requiring high stability.
Cryogenic Systems
Bluefors XLDHe 1K High Power Measurement System
Bluefors XLDHehp is a high cooling power 1K cryogenic system, providing a stable low temperature environment for quantum applications and high-performance cryogenic measurements. The system supports large heat loads, high-density wiring, and low noise RF/DC measurements, suitable for spin qubits, cryogenic detectors, and ultra-low temperature research.
Cryogenic Systems
Bluefors XLDHesl 1K Measurement Systems
Bluefors XLDHesl is an integrated 1K side-loading cryogenic system that provides a stable low-temperature environment for quantum applications and high-performance cryogenic research. The side-loading design supports high-density wiring, flexible expansion, and quick replacement of measurement infrastructure for complex quantum experiments.
Cryogenic Systems
Bluefors LDHe 1K Measurement System
The 1K cryogenic measurement system using helium is designed for ultra-low temperature experiments in superconducting material research, quantum physics, and quantum devices. An optimal solution for modern R&D laboratories.
Cryogenic Systems
Bluefors SDHe 1K Measurement System
The 1K cryogenic measurement system using helium (SDHe), compact design for low temperature experiments in superconducting material research, quantum physics, and quantum technology. A flexible solution for modern R&D laboratories.
Cryogenic Systems
Bluefors Cryogenic Wafer Prober
Cryogenic wafer testing system for quantum chips, allowing characterization of quantum devices and superconducting circuits at ultra-low temperatures, supporting research and development of quantum computing technology in a wafer-level environment.
Maskless Laser Lithography (MLA)
MLA 300 Maskless Aligner - Heidelberg Instruments
The MLA 300 is optimized for high volume production. The Spatial Light Modulator (SLM) technology allows for distortion correction for each die, automatically focusing on curved surfaces, compatible with SECS/GEM. Completely eliminates the costs and hassles of physical masks. Applications in MEMS production, sensors, ASIC, advanced packaging, power electronics.

Maskless Laser Lithography (MLA)
ULTRA Maskless Aligner - Heidelberg Instruments
ULTRA is a lithography machine using two high-speed SLMs. Layer accuracy of 30 nm, CD uniformity of 30 mm, minimum size of 500 nm. DPSS 355 nm laser reduces operating costs by 80%. Producing masks for semiconductors, easily integrated into the mask production workshop.

Physical Vapor Deposition (PVD)
UHV Thin Film Deposition System LAB Line

The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

Maskless Laser Lithography (MLA)
VPG 300 DI Maskless Stepper - Heidelberg Instruments
The VPG 300 DI is a direct write lithography machine that inherits technology from the VPG (Volume Pattern Generator) line used in mask production. The VPG 300 DI is equipped with a Zerodur table, a differential interferometer, and a DPSS laser at 355 nm. Resolution down to 500 nm, layer 2 alignment (global) achieves 100 nm. Ideal for industrial R&D, small batch production, mix-and-match with a stepper.

Advanced Packaging & Testing
Thin Wire Wedge-Wedge Bonder F&S Bondtec 5330

F&S Bondtec 5330 is a Wedge-Wedge wire bonding machine specialized for gold wire, aluminum wire 17.5–75 µm, and ribbon up to 250 µm. Integrated with a Z-axis driven by a linear stepper motor for automatic wire feeding and cutting, ensuring high repeatability of the bond suitable for R&D, prototyping, small-scale production, and microchip repair.

 

Advanced Packaging & Testing
Automatic Large Area Bonder Heavy-Wire F&S Bondtec 8650

The F&S Bondtec 8650 automatic wire bonding machine features flexible Wedge-Wedge bonding technology for large wires combined with an intelligent image recognition system (PRU). The machine achieves an X/Y travel of up to 700x480 mm with a large force range from 0-1800 cN and integrates CO2 snow cleaning. The device optimizes packaging speed, eliminates manual errors, and is ideal for R&D and the production of hybrid circuits, with average COB output.

Advanced Packaging & Testing
Weld Bonding F&S Bondtec 90 series

The F&S Bondtec Series 90 is groundbreaking with the philosophy of "6 in 1", allowing for quick swapping between automatic wire soldering heads and pull/shear testing on the same platform. The machine features an ultra-wide working area of 480x700mm along with an intelligent PRS image recognition system, optimizing accuracy and processing speed. This solution helps businesses maximize equipment investment costs and flexibly change production models continuously without worrying about memory limitations. Series 90 is the ideal choice for applications in microchip packaging, power semiconductor components, and connecting electric vehicle battery cells.

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