Main features
- Advanced Cover Chuck technology: Optimizes the Uniformity of the coating film, minimizes the consumption of photoresist, and completely eliminates the cotton candy effect when coating high-viscosity materials.
- Flexible modularization (Selectable Process Modules): Allows for diverse integrated configurations from Spin Coater (open bowl or lid-mounted chuck), Spray Coater (Ultrasonic Nozzle), Developer (spray or Puddle) to heating and cooling plates (Hot- & Cool-plates).
- Proprietary control software CLS (Cluster Software): User-friendly GUI interface on a 10" or 22" touchscreen that allows precise programming of all motion parameters of the nozzle, flow rate of the solution, and easy editing of the Recipe.
- Syringe Servo Motor-Controlled liquid distribution system: Control of the piston by a servo motor allows for continuous or extremely precise dosing, integrating a suck-back function to prevent dripping.
High-end cleanroom design: The machine housing is made of durable stainless steel with powder coating, integrating a transparent protective door and an emergency stop button, strictly meeting cleanroom standards ISO Class 4.
Detailed description
- Technology/Principle: The n.unixx-series system operates on the principle of centrifugal spin coating and semi-automatic spray coating for single substrate panels. In the Spin Coater module, the covered chuck technology is applied to control the aerodynamic flow around the substrate, helping to optimize surface uniformity. For the Spray Coater module, the device uses a 6-axis robotic mechanism with linear X-Y-Z motion combined with an ultrasonic spray nozzle to achieve fine and uniform coating of solutions with low to medium viscosity.
- Highlights: In traditional open bowl photolithography processes, coating thick photoresists or BCB materials often causes the cotton candy effect, leading to contamination of the machine chamber and reduced film uniformity. Additionally, the waste of photoresist chemicals has always been a costly headache. To address this, the n.unixx-series with covered chuck technology completely eliminates the polymer fiber effect, protects the backside of the wafer, and significantly reduces the amount of photoresist chemicals consumed.
- Integration/Expansion: The device offers high customization capabilities thanks to its modular design. Users can integrate additional electronic liquid dispensing arms (Up to two electric media arms) supporting up to 6 chemical supply lines, an external chemical cabinet system (External media cabinets) with integrated high-level warning sensors, or upgrade the factory management connectivity feature via the optional SECS/GEM protocol.