EIS-200ERP (Elionix Ion Beam Etching/Sputtering System): This is an ion beam etching/sputtering system capable of nano-level material etching and deposition utilizing an ECR (Electron Cyclotron Resonance) ion beam.

The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.