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14 items found.

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Method & Application
Quantum Materials & Components - 14 items

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Solar & Lithium Batteries

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RESET

Flip-Chip Bonder SET ACCµRA100

Flip-chip Bonding

Flip-Chip Bonder SET ACCµRA100

Ball-Wedge Bonder F&S Bondtec 5810

Advanced Packaging & Testing

Ball-Wedge Bonder F&S Bondtec 5810

Thin Film Deposition System AXXIS

Physical Vapor Deposition (PVD)

Thin Film Deposition System AXXIS

Thin Film Deposition System PRO Line PVD 200

Photo-PVD200-Load Lock-Web.webp

Physical Vapor Deposition (PVD)

Thin Film Deposition System PRO Line PVD 200

Glove Box Jacomex G(Box)

Fundamental Research Equipment

Glove Box Jacomex G(Box)

Automatic Large Area Bond Tester F&S Bondtec 8600C

Advanced Packaging & Testing

Automatic Large Area Bond Tester F&S Bondtec 8600C

Physical Vapor Deposition Batch In-Line KDF

Physical Vapor Deposition (PVD)

Physical Vapor Deposition Batch In-Line KDF

Flip-Chip Bonder FC300 SET SAS

Flip-chip Bonding

Flip-Chip Bonder FC300 SET SAS

Flip-Chip Bonder ACCµRA OPTO SET SAS

youtube - [Video]

Flip-chip Bonding

Flip-Chip Bonder ACCµRA OPTO SET SAS

Manual Flip Chip Bonder ACCµRA M SET SAS

youtube - [Video]

Flip-chip Bonding

Manual Flip Chip Bonder ACCµRA M SET SAS

Aligner Wafer Bonder AWB-08 AML

In-situ Alignment Bonding

Aligner Wafer Bonder AWB-08 AML

Atomic Layer Deposition TSF200

Atomic Layer Deposition (ALD)

Atomic Layer Deposition TSF200

Versatile ALD platform Beneq Transform®

Atomic Layer Deposition (ALD)

Versatile ALD platform Beneq Transform®

Inline Inspection System VEreveal® PVA TePla

Wafer Inspection & Metrology

Inline Inspection System VEreveal® PVA TePla

Showing 14 of 14 results

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