Possessing atom probe tomography (APT) technology, EIKOS-UV atom probe microscope brings the ability to detect single atoms with near-atomic spatial resolution. The device provides a quantitative 3D compositional map, being the optimal cost-effective solution for metallurgical research, additive manufacturing (3D printing), and thin films with superior performance.

The Apex XCT-150 is an X-ray microscope that delivers incredible results by providing sub-micron resolution 3D imaging in just minutes. It is an advanced tool for failure analysis and packaging in the semiconductor industry. The system features a spatial resolution of 0.5 microns anywhere on samples up to 300 mm in diameter. With the Apex XCT, failure analysis workflows can be streamlined by imaging entire intact packages, wafers, and PCBs, minimizing time-consuming and destructive sample preparation.

CIQTEK HEM6000 integrates technologies such as a high-brightness electron gun with a large beam current, a high-speed electron beam deflection system, and a high voltage sample deceleration mechanism. The device accelerates the speed of large-scale nano structure imaging up to 5 times faster than conventional FESEM, providing a perfect large-scale 3D reconstruction solution for the semiconductor and biological industries (biological 3D reconstruction).