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Overview of WEFAB 2026

Solving the "BOTTLE NECK" Problem from Design to Chip Production and Solutions from ADST
June 23, 2026 by
Overview of WEFAB 2026
ADST
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Recently, on June 19, 2026, in Hanoi, the International Workshop on Design, Chip Production, and Sensor Technology (WeFAB 2026) was successfully held. As one of the most prestigious events in the national semiconductor ecosystem since 2018, WeFAB 2026 this year continues to affirm its stature by gathering over 200 experts, scientists, representatives from major technology corporations, and leading investment funds both domestically and internationally.

The event was organized by the High-Tech Park and Innovation (Vietnam National University) and took place in the context of Vietnam accelerating the implementation of the semiconductor industry development strategy until 2030.

Notable technology highlights at WeFAB 2026

This year's workshop witnessed profound sharing from great minds in the industry such as Professor Behzad Razavi (University of California Los Angeles – UCLA, USA), Professor Kazuo Umemura (Tokyo University of Science, Japan), Dr. Le Quang Dam (General Director of Marvell Vietnam), along with experts from Singapore, Taiwan, and the Japan Science and Technology Agency (JST)....

The core discussion sessions at WeFAB 2026 focused directly on the real challenges that universities, research institutes, and Vietnamese businesses are facing.

Read more about WEFAB

Experts have candidly acknowledged: the biggest "bottleneck" currently is how to transform design capabilities into actual chip products. Vietnam still lacks testing infrastructure, prototype production, and post-design evaluation, making it difficult for many startups and universities.

ADST – The pioneering companion for Semiconductor infrastructure in Vietnam

To realize the dream of "Made in Vietnam" chips and complete the national semiconductor ecosystem, owning standardized R&D laboratories with modern equipment is a decisive factor.



ADST has made a strong mark as a Gold sponsor alongside the partnership with CAMECA - the world's leading brand in semiconductor analysis and measurement equipment, affirming our strong commitment to promotion.


The leading technology trends promoted at WeFAB 2026 are also the cutting-edge solution ranges that ADST is providing through the Semiconductor Equipment and Strategic Technology portfolio:

  1. WaferFab & Advanced Lithography Manufacturing: Providing maskless lithography systems from Heidelberg Instruments, E-beam lithography systems from Elionix, along with versatile thin film manufacturing systems from K.J. LESKER – perfectly meeting the needs for testing ASIC chips and next-generation power components (GaN, SiC).
  2. Advanced Packaging & Testing: Solutions from SET - SAS and the versatile wire bonding system from FS Bondtec, helping to optimize semiconductor logistics right in the laboratory.
  3. Measurement & Fault Analysis: High-resolution microscopy systems, trace element analysis, and isotopes (CAMECA, NU Instruments, Oxford Instruments, SIGRAY, PVA TePla) help scientists master the quality control processes of thin films and microstructure.

Open collaboration to break through in the new era

WeFAB 2026 has concluded, opening a new chapter for close cooperation between the State – Schools – Enterprises. With the position of a trusted partner of many leading global scientific equipment brands, ADST is committed to accompanying universities and research institutes in the Vietnam Semiconductor Alliance to build modern laboratories, optimize costs, and standardize operational processes.

We believe that with systematic investment in technology infrastructure, Vietnam will soon overcome challenges to become a global talent center and semiconductor ecosystem.


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