Key Features
Smart eKLipse™ Control: Integrated PC-Based HMI interface allows for programming, process control, and intuitive advanced recipe automation.
Flexible box chamber design: Utilizes a 304L stainless steel chamber (100 liters volume) with O-ring sealed side panels, providing maximum modularity and system upgrade capability.
Optional load lock chamber integration: Supports Substrate Load Lock module (on the Open Frame version) for quick sample in/out without venting the entire main chamber.
Multi-source deposition configuration: Allows for flexible combination of up to 6 Torus 3" sputter cathodes, E-beam evaporation source, 4 thermal evaporation sources, or organic LTE source.
Ideal high-temperature processing: Ability to heat the sample stage (maximum size 6") up to 850°C combined with a 100W RF Bias source for pure surface cleaning.
Superior vacuum performance: Achieving an ultra-high base pressure of -5 × 10⁻⁸ Torr thanks to the 1500 l/sec Cryo pump option or high-performance Turbo pump.
Detailed description
The PRO Line PVD 75 system operates based on the principle of physical vapor deposition (PVD) in an ultra-high vacuum environment. The core point in the mechanism of the system is the flexible integration of multiple energy sources on the same 100-liter box chamber platform.
The system allows for the simultaneous configuration of magnetron sputtering technology using proprietary Torus® cathodes, electron beam (E-beam) evaporation, thermal evaporation, and low-temperature organic material evaporation (LTE). When an inert gas flow (such as Argon) is ionized to create plasma, ions will bombard the target material in the Sputtering mechanism; or a high-intensity electron beam will directly hit the crucible in the E-beam mechanism to vaporize the material. These free material molecules move in the ultra-high vacuum environment of -5 × 10⁻⁸ Torr – where the mean free path is extremely large – to travel straight and adhere tightly to the substrate surface.
To control the quality of the thin film, the system uses a continuous substrate rotation mechanism (up to 20 RPM) combined with quartz crystal microbalance (QCM) thickness controllers. At the same time, the intelligent temperature management system allows heating up to 850°C or direct water cooling, helping to shape the crystal structure of the thin film during the deposition process.
Proprietary eKLipse™ software architecture: Unlike competitors who typically use industrial control software running directly on the Windows operating system that is prone to freezing or interruption, eKLipse™ completely separates the user interface (HMI) from the real-time process controller. If the control computer is turned off or encounters a network issue, the deposition recipes still continue to run automatically and safely, providing absolute protection for expensive research material samples from damage.
Vacuum performance and Optimal geometric design: The design of the square box chamber made of 304L stainless steel optimizes the ratio of volume to internal surface area, combined with removable shields. This allows the system to achieve ultra-high base pressure significantly faster than conventional cylindrical chambers of competitors, minimizing wait times (higher throughput index) and preventing cross-contamination of the base gas.
Compact Dome Shutter design: While other systems use flat sliding shutters that take up a lot of space and are prone to jamming due to material buildup, the PVD 75 employs a curved dome hatch design that hugs the source closely. This solution optimizes the distance from the source to the base, while absolutely preventing cross-contamination between material sources when operating in multilayer mode.