Key features
Open front box chamber structure: Box chamber design made of stainless steel maximizes source distribution space for easy handling, reconfiguration of components, and regular maintenance.
Simultaneous multi-technology PVD integration: Allows for flexible configuration of electron beam (E-beam) evaporation, thermal evaporation, and magnetron sputtering on a single platform without material cross-contamination.
Proprietary eKLIPSE control system: Intuitive PC/PLC control platform that supports fully automated recipe setup, closed-loop control of deposition rate, and accurate storage of operational data.
Fast cycle load lock chamber option: Completely isolates the main processing chamber to maintain stable ultra-high vacuum pressure, minimizing sample load/unload time between coating runs.
Detailed description
The Kurt J. Lesker AXXIS thin film deposition system sets a new standard for PVD (physical vapor deposition) equipment in the advanced R&D and small-scale manufacturing segment thanks to its comprehensive modular operating mechanism. The focus of the system is its ability to flexibly switch between different deposition techniques without compromising the integrity of the ultra-clean vacuum environment. Compared to competitors in the market that often have fixed configurations or require complex hardware changes that are time-consuming, AXXIS allows users to simultaneously integrate multi-pocket E-beam evaporation sources along with magnetron sputtering sources and thermal evaporation sources around the chamber. This versatile combination enables the fabrication of complex multilayer films in just a single vacuum cycle.
The angle control mechanism for deposition is a core technological advantage of AXXIS in semiconductor and optoelectronic applications, particularly in the Lift-off process. Thanks to the accurately simulated box-shaped chamber geometry design, the distance from the material source to the substrate is maximized. This creates a vapor particle beam that approaches almost perfectly perpendicular to the wafer surface. When combined with a continuous planetary sample rotation mechanism with dual-axis motion, the system completely eliminates the shadowing effect, ensuring that the thin film covers micro and nano structures with ideal sidewall coverage and uniform thickness (with a deviation of less than 2%) across the entire surface area of the substrate up to 200 mm.
In terms of automation, the proprietary eKLIPSE™ control software based on the PC/PLC platform significantly outperforms conventional controllers from competitors by providing a closed-loop control architecture. The system continuously acquires signals from the quartz crystal microbalance (QCM) sensor to adjust the power source excitation current in real-time with a delay measured in milliseconds. This fast feedback mechanism ensures that the deposition rate remains stable, helping the film thickness variation between batches (run-to-run repeatability) achieve atomic-level accuracy. Additionally, the integration of strict hardware safety interlocks actively protects the high-voltage power supply, gas flow, and turbomolecular pump system from sudden overpressure incidents, providing superior operational reliability and minimizing long-term maintenance costs for the laboratory.