Main features
- Automatic wire bonding system: increases stability and reduces dependence on operator handling
- Supports wire sizes of 100–500 µm (Al) and 100–300 µm (Cu): expands the application range for heavy-wire bonding
- Wedge-Wedge Front/Back Cut mechanism: flexible design of the bond and optimizes the wire cutting process
- Voice-Coil pressure force 0–1800 cN: precise force control, improves bond quality
- Ultrasonic 60 kHz (optional 40–120 kHz): optimizes material compatibility and bonding surface
- Large travel table with 1 µm resolution: increases positioning accuracy and repeatability of the bond
- Integrated camera and TCP/IP network: supports automation, monitoring, and production system connectivity
Detailed description
F&S Bondtec 8650 (part of the 86xx series) is a large working area automatic wire welding machine system designed specifically for heavy wire processing applications with a flexible welding head change mechanism. The system operates fully automatically, allowing for precise handling of aluminum wire with diameters from 100 to 500 µm and copper wire from 100 to 300 µm, all using 4-inch diameter spools.
The machine integrates a Wedge-Wedge welding head technology for large wires, supporting two flexible wire cutting methods: front cut (Frontcut) or back cut (Backcut) with a standard Wedge tool length of 2 inches (expandable up to 90 mm).
In terms of kinematics, the device features a wide-moving sample table with a standard travel range without the cleaning system configuration of X = 700 mm, Y = 480 mm, Z = 100 mm. When additionally integrating a carbon snow cleaning system (optional CO2 JetBox), the X-axis travel is fine-tuned to X = 650 mm.
The drive system achieves a fine step resolution of 1 µm with a repeatability of 5 µm, allowing all axes to program flexible movement speeds from 0.2 to 16 mm/s. The machine uses a standard 60 kHz F&S ultrasonic generator (with optional frequency ranges of 40, 90, 120 kHz) combined with a dynamic coil pressing force system controlling a very wide force range from 0 up to 1800 cN.
Operational Challenges and Solutions
In an average production environment, research and development (R&D), or experimental manufacturing, the biggest challenge is how to optimize the packaging speed of hybrid microchips or chip-on-board (COB) with large areas without compromising quality due to the impact of manual handling.
The 8650 thoroughly addresses this issue by integrating the intelligent image recognition module PRU combined with a high-quality color GigE-CCD camera. The operating process is mechanized: the operator only needs to manually feed the workpiece/component into the machine, after which the system automatically identifies and accurately performs a series of individual welds in just a few seconds, completely unaffected by human factors.
Another challenge in workshop management is controlling the welding parameter errors and synchronizing quality calibration data. The system solves this problem thanks to a Dual Core PC configured computer running Windows, supporting comprehensive network connectivity via TCP/IP server protocol and Ethernet, USB 2.0/3.0 connection ports. The management software integrates multi-level password security access control and operator profile management. The machine also supports an optional barcode reader for product identification, while allowing direct feedback of measurement values to the chip welding machine and wire welding machine to automatically optimize operational parameters.
Integration and Expansion Capability
The 8650 system possesses strong hardware expansion capabilities to meet strict industrial standards:
Optional surface cleaning system (CO2 JetBox): Integrates CO2 snow cleaning technology directly before welding, helping to remove contaminants and enhance the adhesion of the joint.
Optional improved wire feeding system: Supports the integration of a wire unwind reel equipped with a controlled motor to maintain a stable and uniform wire tension for large gauge wires.
Observation optical system: The machine comes with a standard stereo microscope, while also allowing optional integration of other high-end microscope lines according to needs.

