The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

IQM Radiance: Our most powerful on-premise quantum computer with 20, 54, or 150 qubits for high-performance computing (HPC) centers and quantum computing pioneers to use for groundbreaking scientific discoveries and real-world challenges.

SPECS EnviroMETROS is the next generation of XPS surface measurement systems (Surface Hybrid Metrology) that is revolutionary, designed specifically for analyzing the chemical composition in depth of thin films from laboratory scale to semiconductor manufacturing. The system integrates core technology of angle-resolved X-ray photoelectron spectroscopy (ARXPS) that is fully automated, combining flexible multi-source X-ray energy and the ability to operate in a very wide pressure range from ultra-high vacuum (UHV) to near-atmospheric pressure (NAP). This is the optimal solution for analyzing layer structure and material properties without destroying the sample.

Nanonis Tramea™ is a new generation quantum measurement and nano-structure testing system, fully integrating traditional laboratory equipment into a single plug-and-play digital solution. Equipped with proprietary 22-bit hrDAC™ technology and a high-speed real-time FPGA processor, the system allows simultaneous data acquisition of up to 24 channels at an extremely fast rate of 20,000 points/second without compromising signal quality. This groundbreaking solution completely eliminates loop noise and the risk of sample damage due to cable changes, providing optimal signal-to-noise ratio (SNR) performance for quantum transport measurement studies and high-performance investigations.

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.

The AWB 04 wafer bonding and alignment machine provides a comprehensive adhesive bonding control process in a single chamber (in-situ), achieving superior alignment accuracy of 1 µm and a pressing force of up to 40 kN. The device features high flexibility, a compact design that optimizes space, making it an ideal solution for applications ranging from research and development (R&D) to high-performance production for 3", 4", 6" semiconductor wafers and custom chips.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.

Beneq Transform® is a high-end industrial standard ALD system for mass production in the "More-than-Moore" era. The machine integrates both Thermal ALD and PEALD, flexibly processing semiconductor wafers from 3" to 8" (with a roadmap up to 12"). This is the core thin film solution for Power Electronics (GaN, SiC), RF, MEMS, sensors, MicroLED, and Photonics.

PVA TePla SIRD uses non-destructive infrared scanning technology to map mechanical stress and internal defects in semiconductor wafers (Si, SiC, GaAs) up to 300mm. The device provides superior sensitivity, fast scanning speed, ideal for both R&D research and inline mass production process control.