The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

IQM Radiance: Our most powerful on-premise quantum computer with 20, 54, or 150 qubits for high-performance computing (HPC) centers and quantum computing pioneers to use for groundbreaking scientific discoveries and real-world challenges.

SPECS EnviroMETROS is the next generation of XPS surface measurement systems (Surface Hybrid Metrology) that is revolutionary, designed specifically for analyzing the chemical composition in depth of thin films from laboratory scale to semiconductor manufacturing. The system integrates core technology of angle-resolved X-ray photoelectron spectroscopy (ARXPS) that is fully automated, combining flexible multi-source X-ray energy and the ability to operate in a very wide pressure range from ultra-high vacuum (UHV) to near-atmospheric pressure (NAP). This is the optimal solution for analyzing layer structure and material properties without destroying the sample.

Nanonis Tramea™ is a new generation quantum measurement and nano-structure testing system, fully integrating traditional laboratory equipment into a single plug-and-play digital solution. Equipped with proprietary 22-bit hrDAC™ technology and a high-speed real-time FPGA processor, the system allows simultaneous data acquisition of up to 24 channels at an extremely fast rate of 20,000 points/second without compromising signal quality. This groundbreaking solution completely eliminates loop noise and the risk of sample damage due to cable changes, providing optimal signal-to-noise ratio (SNR) performance for quantum transport measurement studies and high-performance investigations.

The n.unixx-series Wafer bonding device applies breakthrough Thermal-Pressure Bonding technology. The system features a sophisticated mechanical pressure generator and a heating temperature range of up to 200°C with uniformity of ±0.5°C, providing a perfect film bonding connection. The device is an ideal solution to optimize the single wafer bonding process for MEMS applications, micro-electromechanical systems, and advanced semiconductor packaging.

The n.unixx-series wafer separation system uses advanced Thermal Slide Separation technology with adjustable separation force. The system integrates independent heating plates for the wafer and carrier, reaching temperatures up to 200°C along with a protective vacuum line. The device is an ideal solution for safely handling sensitive ultra-thin wafers in 3D-IC packaging, stacked semiconductor chips, and MEMS.