Main features
"6 in 1" soldering head swapping technology: Automatically identifies and flexibly switches between 5 soldering techniques (from fine wire to large metal strips) and 1 pull/shear testing head, maximizing investment savings on multiple separate machine bodies.
Ultra-wide working area of 480 x 700 mm: Smoothly processes large circuit boards, multiple trays of substrates, or bulky electric vehicle battery modules in a single setup to optimize productivity.
Powerful PRS image recognition system: Automatically locates, aligns coordinates, and accurately captures solder points, completely eliminating errors caused by manual operation.
Integrated 00i testing head with exclusive copyright: Automatically adjusts the pull/shear testing angle through quick-change cartridge boxes, providing the most objective and accurate joint reliability testing results.
Unlimited storage for soldering programs: Allows for the immediate setup, storage, and conversion of various product configurations in bulk, enabling businesses to flexibly meet all R&D timelines and multi-model production.
Next-generation intuitive control software: Freely customize the pressing force parameters, ultrasonic power, and loop profile, ensuring consistent joint quality across all difficult material surfaces.
Detailed description
The F&S Bondtec Series 90 operates on a precision mechanical platform with X-Y-Z axes combined with a new generation ultrasonic feed system. The core principle that powers the system is the "Plug-and-Produce" concept through intelligent bonding heads.
When the user changes the welding head (for example, from a fine wire welding head to a tensile testing head), the central control board automatically identifies the ID of the functional head, activates the corresponding control driver, and synchronizes the software configuration instantly. The system does not require the operator to deeply intervene in the hardware or realign the coordinate axis from scratch.
In addition, the axis shift principle of Series 90 closely coordinates with the PRS image recognition system. The high-resolution camera will scan the surface of the workpiece, and the PRS algorithm processes the images in real-time to compensate for the position offset (Pattern Offset) of the chip or board. Then, the welding head will lower and accurately apply the pressing force, time, and ultrasonic power parameters to break the surface oxide layer, creating a strong atomic diffusion bond between the conductor and the substrate.
In R&D environments, laboratories, or prototyping workshops, engineers often face three challenging problems that competing machines on the market have not optimized:
The investment cost for equipment is too high (High CapEx): Typically, to simultaneously weld gold ball-bond wires and large aluminum wires (heavy wire) for batteries, while also wanting to test the tensile strength of the weld (Pull test), companies must purchase 2 to 3 completely separate machines.
- How Series 90 addresses them: The device consolidates all functionalities into a single machine body. Businesses only need to invest in an initial Series 90 platform configuration, then purchase additional functional heads (10i, 30i, 50i, 00i) according to their budget and actual needs, helping to save up to 60% on hardware investment.
The working space is limited: Competitors' desktop bonders often have a restricted working area (about 100x100mm or 150x150mm), which cannot accommodate large trays or bulky electric vehicle (EV Battery Pack) modules.
- How Series 90 solves: It has superior working space 480 x 700 mm. This size allows for the direct placement of entire battery assemblies or large printed circuit boards (PCBs) into the working area for automatic mass soldering without the need to break them down or design complex jigs.
Human error during the inspection process (Operator Influence): When using a manual welding inspection machine, the uneven pulling force or angle of the technician can skew the quality report results.
- How Series 90 solves: Test head 00i (Pull & Shear tester) of Series 90 uses a patented proprietary solution that helps automatically adjust the test angle. The entire process of pulling, cutting, destructive or non-destructive testing is programmed to run automatically 100%, exporting reports automatically to Excel/PDF files, ensuring complete objectivity for QC data.
The Series 90 system is designed to be open to easily accompany the long-term development of the factory:
Unlimited software integration: F&S Bondtec's control software allows for unlimited storage of programs (Bond programs). When the factory updates the design of new components, engineers only need to create a Loop profile or customize new ultrasonic parameters and save them, without worrying about running out of memory.
Smart communication: The machine is equipped with modern communication interfaces, ready to link data with the factory's Manufacturing Execution System (MES) to monitor the quality history of each joint on each product (Traceability).
Flexible hardware upgrades: The pull/shear test head (00i) uses a cartridge system (Easily changeable cartridges). When needing to change the force range (from measuring thin wires of a few grams to measuring large wires of several kilograms), users simply need to pull this cartridge out and plug another cartridge in, and the system automatically resets the scale within seconds.