The automatic Ball-Wedge wire bonding machine 5810 F&S Bondtec features a flexible interchangeable bonding head along with an intelligent image recognition system. The device provides a repeatability accuracy of ±3 µm, operates fully automatically without operator dependence to optimize productivity. The product is an ideal solution for R&D applications, pilot manufacturing, and medium-scale production.

The LAB-Tester LT-101 is a compact, streamlined tensile testing machine for welds. The device is equipped with advanced updated software to perform tensile testing easily and quickly. The machine is designed to be versatile, well-suited for both fine wire and large wire applications in the semiconductor packaging industry.