µMLA is a maskless lithography machine in a benchtop format, highly flexible and customizable. It offers two recording modes: Raster Scan (high speed, excellent image quality) and Vector Scan (optimized for curves, low edge roughness). Variable resolution, supporting up to 3 wavelengths (LED/laser). A compact solution for MEMS research, microfluidics, and micro-optics.

DWL 2000 GS / 4000 GS meets industrial standards, supports CAD output with 1023 gray levels. The proprietary Grayscale technology from Heidelberg Instruments allows for the creation of 2.5D structures and micro lenses with a surface roughness down to 5nm. An optimal solution for hologram fabrication, light diffusion modules, and Fresnel lenses in optical research and micro-optics.

The DWL 66+ is a versatile laser lithography machine, the highest resolution in the R&D segment with the smallest size of 200 nm. It supports the creation of 2.5D (grayscale) structures on thick photoresist, with XR writing mode for maximum stability and resolution. Ideal for material research, micro-electronics, and small quantity mask lithography.

The MLA 300 is optimized for high volume production. The Spatial Light Modulator (SLM) technology allows for distortion correction for each die, automatically focusing on curved surfaces, compatible with SECS/GEM. Completely eliminates the costs and hassles of physical masks. Applications in MEMS production, sensors, ASIC, advanced packaging, power electronics.

ULTRA is a lithography machine using two high-speed SLMs. Layer accuracy of 30 nm, CD uniformity of 30 mm, minimum size of 500 nm. DPSS 355 nm laser reduces operating costs by 80%. Producing masks for semiconductors, easily integrated into the mask production workshop.

The VPG 300 DI is a direct write lithography machine that inherits technology from the VPG (Volume Pattern Generator) line used in mask production. The VPG 300 DI is equipped with a Zerodur table, a differential interferometer, and a DPSS laser at 355 nm. Resolution down to 500 nm, layer 2 alignment (global) achieves 100 nm. Ideal for industrial R&D, small batch production, mix-and-match with a stepper.

NanoFrazor uses technology maskless thermal etching (t-SPL) with a sharp probe, creating highly accurate nano structures, without the need for electron beams or expensive masks. The etching depth error <1nm, integrates in-situ inspection, supports 3D grayscale for nano optics, quantum sensors, biological membranes. The Decapede module with 10 probes increases throughput by 10 times.

The MLA 150 is a new generation maskless lithography machine, directly projecting digital designs through a spatial light modulator (SLM). The global layer 2 alignment accuracy reaches 500 nm, with a writing speed of up to 1400 mm²/min. Ideal for rapid prototyping, low to medium volume production, and R&D in MEMS, micro-optics, and sensors.