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Solar & Lithium Batteries
Accelerator Mass Spectrometry (AMS)
Mini Carbon Dating System ¹⁴C (MICADAS)

MICADAS is the leading AMS ¹⁴C system from Ionplus AG, providing superior accuracy, energy efficiency, and a compact design for advanced radiocarbon dating applications.

Advanced Packaging & Testing
Ball-Wedge Bonder F&S Bondtec 5810

The automatic Ball-Wedge wire bonding machine 5810 F&S Bondtec features a flexible interchangeable bonding head along with an intelligent image recognition system. The device provides a repeatability accuracy of ±3 µm, operates fully automatically without operator dependence to optimize productivity. The product is an ideal solution for R&D applications, pilot manufacturing, and medium-scale production.

3D X-ray Microscopy (XRM)
XRF Microscope AttoMap-310

The AttoMap-310 provides trace element mapping capabilities with an exceptional sensitivity that is 1000 times higher than SEM-EDS. Sigray's proprietary X-ray source technology enables a spatial resolution down to <3-5µm and speeds up to 5ms/point, delivering a breakthrough solution for semiconductor research, mineralogy, and materials science.

3D Atom Probe (APT)
3D Atom Probe Tomography APT EIKOS

Possessing atomic probe tomography (APT) technology, EIKOS-UV atomic probe microscope brings the ability to detect single atoms with near-atomic spatial resolution. The device provides a quantitative 3D compositional map, being the optimal cost-effective solution for metallurgical research, additive manufacturing (3D printing), and thin films with superior performance.

High-Resolution Ultra-Trace Analysis
X-ray Photoelectron Spectrometry (XPS) SPECS ProvenX

Danh mục sản phẩm của SPECS đã được mở rộng với dòng hệ thống quang phổ XPS ProvenX, đại diện cho đỉnh cao từ nền tảng kiến thức rộng lớn của chúng tôi trong việc phát triển và sản xuất các hệ thống phân tích toàn diện nhằm đáp ứng những yêu cầu khoa học khắt khe nhất. ProvenX bao gồm một loạt các hệ thống XPS chuyên dụng cho ARPES, µ-ARPES, Kính hiển vi động lượng (Momentum Microscopy), XPS/UPS cũng như NAP-XPS.

X-ray Diffraction (XRD)
Horizontal electron diffractometer ELDICO ED-1

As the world's first dedicated horizontal electron diffraction machine, the ELDICO ED-1 combines a 160 keV beam source and a DECTRIS QUADRO detector. The device achieves a resolution of <0.84 Å, enabling rapid decoding of nano crystal structures (10–1000 nm). This is the optimal cost-effective solution for pharmaceutical research, battery materials, and agricultural chemicals.

Physical Vapor Deposition (PVD)
Thin Film Deposition System AXXIS
AXXIS is a versatile PVD thin film deposition system designed for research and development (R&D) activities that require various coating techniques on the same equipment. The system allows for the combination of Magnetron sputtering, thermal evaporation, and electron beam evaporation while supporting co-deposition to create multi-component films or complex alloys.
Inductively Coupled Plasma Time-of-Flight Mass Spectrometry (ICPMS-TOF)
Time-of-Flight ICP-MS Vitesse

Vitesse is an Inductively Coupled Plasma Time-of-Flight Mass Spectrometry (ICP-TOF-MS) system, specifically designed for high-speed multi-element applications such as laser ablation imaging and nanoparticle analysis. It features a segmented reaction cell and powerful interference removal capabilities, making it an ideal solution for geochemical, biological, environmental, and materials research.

Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 200

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

High-Resolution Ultra-Trace Analysis
X-ray Photoelectron Spectrocopy (XPS) SPECS EnviroESCA

SPECS' EnviroESCA is an electron spectroscopy system for chemical analysis in real-world environmental conditions thanks to breakthrough (N)AP-XPS technology. The device operates at pressures of up to hundreds of mbar, integrating a micro-focused AlKalpha monochromatic X-ray source and Environmental Charge Compensation to automatically neutralize background charging. EnviroESCA minimizes the time from loading to measuring samples, ideal for research on biological materials, polymers, batteries, catalysts, and liquids.

3D X-ray Microscopy (XRM)
XRF Microscope AttoMap-200
MicroXRF laboratory achieves the highest resolution with a micron-sized unit (3-5 µm) using high-resolution optics. Sensitivity below ppm for quantification down to parts per million (ppm). Along with Sigray's flexible software packages for energy tuning, maximizing throughput and sensitivity with up to 5 different angled X-ray spectra.  
X-ray Absorption Spectroscopy (XAS)
X-ray Absorption Spectroscopy (XAS) QuantumLeap-H2000

QuantumLeap is an advanced X-ray Absorption Spectroscopy (XAS) system featuring dual transmission and fluorescence modes. The system offers a wide energy range from 4.5 to 25 keV and stands as the only laboratory-scale XAS that delivers synchrotron-equivalent performance directly to your lab, providing solutions for batteries and solar cells, catalysis, and heavy element research.

X-ray Absorption Spectroscopy (XAS)
X-ray absorption spectroscopy (XAS) QuantumLeap-V210

The first XAS system capable of analyzing low atomic number samples and micro-point analysis. Allows XANES measurements at 0.7 eV and EXAFS within seconds or minutes. MicroXAS with a spot size of 100 microns with an automated sample stage allows XAS mapping at a resolution of 100 µm on a sample. It is the leading solution for battery research, catalysis, and materials science.

Micro & Nano Imaging
FE - LEEM/PEEM P90 AC

SPECS FE-LEEM/PEEM P90 Series is a next-generation surface electron microscope system, combining a breakthrough between LEEM and PEEM techniques in a minimalist, ultra-stable modular design. Equipped with a Cold Field Emission Gun and an integrated energy filter, the system provides micro-spectral analysis capabilities and displays thin film structure images with superior spatial resolution below 2nm. This is the optimal analytical solution for in situ surface kinetics studies in situ, advanced materials science, and nanotechnology

3D X-ray Microscopy (XRM)
X-ray Microscope (XRM) 3D Apex XCT-150

The Apex XCT-150 is an X-ray microscope that delivers incredible results by providing sub-micron resolution 3D imaging in just minutes. It is an advanced tool for failure analysis and packaging in the semiconductor industry. The system features a spatial resolution of 0.5 microns anywhere on samples up to 300 mm in diameter. With the Apex XCT, failure analysis workflows can be streamlined by imaging entire intact packages, wafers, and PCBs, minimizing time-consuming and destructive sample preparation.

Fundamental Research Equipment
Glove Box Jacomex G(Box)
The G(BOX) Series glove box system is part of the modular equipment segment for pressure and humidity control (Modular Glove Box under Regulated Atmosphere) from Jacomex, designed specifically for scientific and industrial applications. The device features a flexible structure, easy to configure and upgrade, providing optimal product protection solutions in environments with controlled humidity or reduced oxygen atmosphere to prevent explosions.
Fundamental Research Equipment
Glovebox Jacomex G(Safe)
The G(Safe) Series glove box system belongs to the high safety protective equipment segment operating in a negative pressure filtered air environment (High Security Glove Box under Negative Pressure Filtered Air) from Jacomex, designed specifically for applications in nuclear research, radiation, and critical industry. The equipment provides a solution for isolation, comprehensively protecting the operator and the environment from harmful agents, radiation, or high biological contamination risks.
Physical Vapor Deposition (PVD)
UHV Thin Film Deposition System LAB Line

The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

Advanced Packaging & Testing
Automatic Large Area Bond Tester F&S Bondtec 8600C
The F&S BONDTEC 8600C is a next-generation, PC-controlled automatic bond tester capable of performing fully automated pull and shear tests over a large area. The system supports versatile test heads, including 100 cN, 1,000 cN, and 5,000 cN Pullheads, as well as 500 cN and 5,000 cN Shearheads, catering to a wide range of force spans and bond quality inspection applications within the semiconductor, battery, and solar energy industries.
High-Resolution Ultra-Trace Analysis
X-ray Photoelectron Spectrocopy (XPS) SPECS EnviroMETROS

SPECS EnviroMETROS is the next generation of XPS surface measurement systems (Surface Hybrid Metrology) that is revolutionary, designed specifically for analyzing the chemical composition in depth of thin films from laboratory scale to semiconductor manufacturing. The system integrates core technology of angle-resolved X-ray photoelectron spectroscopy (ARXPS) that is fully automated, combining flexible multi-source X-ray energy and the ability to operate in a very wide pressure range from ultra-high vacuum (UHV) to near-atmospheric pressure (NAP). This is the optimal solution for analyzing layer structure and material properties without destroying the sample.

Physical Vapor Deposition (PVD)
Physical Vapor Deposition Batch In-Line KDF

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

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