The ACCµRA100 uses semi-automatic robotic axis technology, achieving superior post-weld accuracy of ± 0.5 µm and a large pressing force of 1-1000 N. The device provides high repeatability, optimal cost, and is an ideal solution for research (R&D) and diverse applications such as Flip-Chip, Die attach, MEMS, 3D Packaging.

The automatic Ball-Wedge wire bonding machine 5810 F&S Bondtec features a flexible interchangeable bonding head along with an intelligent image recognition system. The device provides a repeatability accuracy of ±3 µm, operates fully automatically without operator dependence to optimize productivity. The product is an ideal solution for R&D applications, pilot manufacturing, and medium-scale production.

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.

Beneq Transform® is a high-end industrial standard ALD system for mass production in the "More-than-Moore" era. The machine integrates both Thermal ALD and PEALD, flexibly processing semiconductor wafers from 3" to 8" (with a roadmap up to 12"). This is the core thin film solution for Power Electronics (GaN, SiC), RF, MEMS, sensors, MicroLED, and Photonics.

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.