PVA TePla SIRD uses non-destructive infrared scanning technology to map mechanical stress and internal defects in semiconductor wafers (Si, SiC, GaAs) up to 300mm. The device provides superior sensitivity, fast scanning speed, ideal for both R&D research and inline mass production process control.

LuXpector THEA is a high-speed automatic thin film measurement system, combining ellipsometry and reflectometry for superior accuracy. Optimally designed for R&D and mass production, the device measures thickness, refractive index, and layer composition on semiconductor wafers (Si, SiC, GaN, GaAs, etc.) with a processing capability of up to 160 wafers/hour.

VEpioneer® MACRO is a hyperspectral vision inspection system for desktop use, fully integrated and operated with just one button. The device provides non-destructive testing capabilities, identifies surface characteristics, detects thin films, and recognizes deviations from production standards at extremely fast scanning speeds.

VEreveal® uniquely combines optical spectroscopy and hyperspectral imaging technology for non-destructive surface inspection. The device allows for comprehensive assessment of material properties, coating thickness, and detection of defects and contamination on wafers up to 300mm with high accuracy and speed, suitable for production quality control.