Skip to Content
Flip-Chip Bonder ACCµRA OPTO SET SAS

Price:

0 ₫
  2. Shop
  3. Products
  4. Semiconductor Bonding & Packaging
  5. Flip-chip Bonding
  6. Flip-Chip Bonder ACCµRA OPTO SET SAS
  7. Flip-chip Bonding
Flip-Chip Bonder FC300 SET SAS
Flip-Chip Bonder FC300 SET SAS
Nanoimprint Lithography NPS300 SET SAS
Nanoimprint Lithography NPS300 SET SAS

Flip-Chip Bonder ACCµRA OPTO SET SAS

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

3 people are viewing this right now
0 ₫ 0 ₫

  • Field of Study
  • Brand - SET-SAS
Add to cart
SET-SAS
SET-SAS

Manufacturer of Flip-Chip bonding equipment for the highest precision in the world

Contact Us
Main featuresDetailed description

Main features

Post-link accuracy (± 0.5 µm): Provides perfect alignment and connection capabilities for microchip structures. 

Specialized ultra-low force design (0.2-10 N): Absolute safety protection, preventing mechanical damage to thin, fragile, sensitive optical and photonic components. 

Advanced robotic axis system: Ensures extremely high process repeatability, eliminating numerical errors caused by manual operation. 

Outstanding flexible adaptability : Allows engineers to easily configure and customize to develop a wide range of different applications. 

Easy system accessibility: Optimized interaction design, enabling operators to work conveniently and accelerate setup progress.

Detailed description

Technology & Operating Principles

ACCµRA OPTO operates based on a high-precision mechanical platform synchronized through motorized axes. The core principle of the device is to simultaneously combine strict control between the heating temperature and the ultra-low compression force range. The system allows for precise optical alignment before performing flip-chip bonding processes to assemble sensitive chips onto the wafer base. 

In the field of optoelectronic and photonics assembly, structural components such as laser diodes, lenses, or optical integrated circuits often have very brittle characteristics and are extremely sensitive to force. The use of conventional packaging machines with a large force range can easily cause cracking or misalignment of components. ACCµRA OPTO thoroughly addresses this issue thanks to the design of a low-force bonding head that controls a force range of only 0.2 N to 10 N, protecting the integrity of the material structure while maintaining sub-micron accuracy of ± 0.5 µm. 

Integration/Expansion

 The device is designed with a highly flexible open platform, allowing users to easily optimize for new product lines and materials. The system is specialized for integrating, packaging, and processing advanced applications including Silicon Photonics, Optoelectronics, micro-optical components, and in-depth research topics in laboratories and educational institutions (Education and R&D).

Detailed specifications

Detailed specifications

Specification 

Value

Post-bond accuracy

± 0.5 µm 

Bonding force range

0.2 N ~ 10 N (Low force) 

Operation mode

Motorized axes 

Core attributes

High precision, accessibility, and flexibility 

Target applications (Target applications)

Optoelectronics and Silicon Photonics 

Target segment (Target segment)

Education and R&D (Education and R&D) 


Field of Study Materials Sciences or Semiconductor Technology or Quantum Technology or Solar & Lithium Batteries
Brand SET-SAS
Flip-Chip Bonder ACCµRA OPTO SET SAS
Flip-Chip Bonder ACCµRA OPTO SET SAS
0 ₫