Key Features
- Five Advanced Deposition Modes (5 flexible deposition modes): Comprehensive integration of next-generation technologies on a single hardware platform, including: DC Magnetron, RF Sputtering, Pulsed DC, Reactive Sputtering, and high-energy pulsed technology HIPIMS helps create ultra-dense film structures.
- Sub-1% Uniformity with ERPP™ (Coating uniformity < 1%): When combined with KDF's advanced source (cathode) heads, the uniquely designed sample holder ERPP™ (Enhanced Rotary Planetary Pallet) helps enhance the uniformity of the film across the entire surface of the pallet to an excellent level below 1% and the repeatability between batches below 0.5% for dielectric materials such as SiO_2 and TiO_2.
- High-Throughput Inline Architecture: Uses a high-performance vacuum load lock mechanism combined with quartz thermal lamps for rapid degassing, supporting a dual-pallet loading mechanism and an automatic pallet stacking system to maintain continuous production flow, minimizing wait times.
- Advanced Low-Particulate Design: Depending on the machine model, the system provides a down sputter structure or side sputter configuration combined with linear magnetic motion technology (LMM™), minimizing the fall of dust particles onto sensitive substrates.
- Rugged, Production-Grade Reliability: Building on over 70 years of engineering heritage from MRC, the system is equipped with a sample pallet motion controller using a stepper motor integrated with an optical encoder and a low-pressure hydraulic system ensuring smooth, precise, and durable operation 24/7.
Detailed description
The KDF In-Line system is segmented into product ranges according to the size of the sample pallet and the configuration of the processing chamber:
- 974i Series (Flagship - Downward): The flagship model supports extremely large sample pallet sizes up to 20 x 20 inches (508 x 508 mm), capable of processing substrates up to 2 inches thick and a configuration of 4 targets. Achieves a wafer metallization yield of 200 mm that is 4 times higher than the 900i series.
- 900i Series (Horizontal - Downward): Standard machine line with 3 or 4 source configurations and a sample tray size of 12 x 12 inches (304 x 304 mm). Optimized design for common thin film sputtering applications with excellent cost performance.
- 744i Series (Vertical - Portrait): Dedicated vertical sputtering machine, sample tray size 19 x 19 inches (482 x 482 mm), 4 source configuration. Side-sputter structure helps achieve perfect dust particle control and allows flexible processing of both the front or back side of the wafer.
- 844i Series (Maximum Productivity): Vertical sputtering machine with the largest coverage area up to 26.5 x 30 inches (673 x 762 mm) with 4 sources, providing maximum output for large-scale industrial production lines.