Thin Wire Wedge-Wedge Bonder F&S Bondtec 5330

Main features

Mechanized Z-axis with linear stepper motor: Ensures that the pressure and ultrasonic energy are repeated with high accuracy in every bonding cycle, helping to maintain stable bond quality and structure throughout the device's usage.

Wedge-Wedge bonding head with integrated automatic wire feed and tail cutting function: Automatically positions the wire for bonding and cuts the excess wire after each cycle, optimizing the workflow, increasing productivity, and reducing reliance on manual operation by the operator.

Ability to handle a variety of wires and ribbons: Supports bonding aluminum and gold wires with diameters from 17.5–75 µm, while also capable of bonding ribbons up to 250 µm wide, meeting various application requirements in microelectronics and component packaging.

Programmable linear Y-axis: Integrated with a programmable motion stroke of up to 20 mm, allowing precise positioning of the bonding location, supporting wire loop formation, and executing complex bonding structures with high repeatability.

Store control parameters on internal hard drive: Allows for quick saving and retrieval of welding configurations including pressure, welding time, ultrasonic power, and wire loop styles, helping to shorten setup time and ensure consistency between operations.

Integrated sample table heating controller from 0–250 °C: Allows for adjustment and maintenance of the fixture table temperature directly on the machine to optimize welding conditions, improve adhesion, and reliability of the joint.

Step-by-step guided programming mode: Supports users in building welding programs step by step through a color screen and multifunction control knob, simplifying operation and significantly reducing technician training time.

Detailed description

Technology and operating principle

F&S Bondtec 5330 is a Wedge-Wedge wire welding machine designed for aluminum wire, gold wire, and ribbon welding applications. The device supports wires with diameters from 17.5 to 75 µm and ribbons with widths up to 250 µm thanks to a specialized wire clamping mechanism at the welding head.

Unlike traditional manual welding machines that use entirely mechanical mechanisms, the 5330 is equipped with a Z-axis driven by a linear stepper motor. This mechanism precisely controls the downward movement of the welding head, ensuring that the pressure and ultrasonic energy parameters are consistently repeated in each working cycle. The ultrasonic system operates at a standard frequency of 100 kHz, while also supporting optional 67 kHz or 140 kHz to accommodate different materials and bonding requirements.

In addition, the welding head integrates an automatic wire feed and tail cutting function (Automatic Feed & Tail Function), allowing for continuous welding cycles without manual operation after each weld.

Operational challenges and solutions

In research applications, prototype manufacturing, or small-scale production, one of the common challenges is the inconsistency of the welds due to dependence on the operator's actions. Traditional mechanical welding systems often create variations in pressure, wire height, or contact position between working cycles.

F&S Bondtec 5330 addresses this issue by fully mechanizing the movement in the Z direction. As a result, the technological parameters are reproduced with high repeatability, helping to reduce discrepancies between welds and enhance product consistency.

Setting up the program is also simplified through a color screen combined with a control knob. The step-by-step programming guide function assists users in building the welding program directly on the machine and storing all parameters on the internal hard drive for reuse in future production batches.

Integration and expansion capabilities

The machine's motion system includes a Z axis with a stroke of 60 mm, a programmable linear Y axis with a stroke of 20 mm, and a mechanical X/Y manipulator with a working area of 18 × 18 mm at a geometric ratio of 1:7. This configuration allows the operator to create various forms of wire loops and handle complex bonding structures.

The device also integrates a built-in heating controller with a temperature range from 0 to 250 °C, supporting direct temperature control of the fixture on the machine. Thanks to its ability to process various types of wire and ribbon materials, along with an internal program storage system, the F&S Bondtec 5330 is suitable for applications in laboratories, research and development (R&D), prototype manufacturing, pre-production, and microelectronics repair.