Ball-Wedge Bonder F&S Bondtec 5310

Main features

Z-axis mechanization with linear stepper motor: Ensures precise and repeatable ultrasonic force and energy, maintaining consistent weld quality.

Integration of Bumping and Stitchbond modes: Provides maximum flexibility by allowing both ball bumping and continuous layer bonding on the same device.

Fine resolution motion axis of 1 µm: Enhances accuracy when setting a standard working height of 55 mm for complex microchip structures.

Store parameters to internal hard drive: Facilitates quick setup by saving the entire configuration of force, time, ultrasonic power, and loop styles.

Integrated heating controller from 0–250 °C: Supports direct control of the sample table temperature, optimizing the adhesion of gold wire on solder pad surfaces.

Control interface via rotary selection wheel: Streamlines the programming process through a color display with an intuitive menu, allowing operators to master the machine with minimal training time.

Mechanical manipulation system with a 1:7 conversion ratio: Enables precise movement within a working area of 18 × 18 mm when fabricating test samples or repairing microchips.

Detailed description

F&S Bondtec 5310 is a manual wire bonding machine specifically designed for processing gold wire (Gold wire) with diameters ranging from 17.5 to 50 µm on a 2-inch spool. The device uses a Ball-Wedge design bonding head for gold wire, combined with a standard 16 mm travel capillary tube or an optional 19 mm type. The machine flexibly integrates both bumping mode and stitchbond mode.

The ultrasonic system of the machine uses a standard 67 kHz F&S Generator frequency source. To meet the specific requirements of the bonding pad surface, the manufacturer also offers higher frequency options including 120 kHz, 130 kHz, and 140 kHz.

Unlike traditional fully mechanical manual bonding machines, the Z-axis of the 5310 is mechanized by a linear stepper motor with a travel distance of 60 mm and a fine step resolution of 1 µm, helping to establish a standard working height of 55 mm. Movement in the X and Y directions is directly controlled through a mechanical manipulation system within a working area of 18 × 18 mm, equivalent to a geometric conversion ratio of 1:7.

In the fabrication of test samples, microchip repairs, or small-scale production, the biggest challenge of traditional manual bonding machines is the lack of consistency between bonds. The quality of the bond heavily depends on the operator's feel for force and skill, leading to the risk of bond heel errors or uneven pressure over time.

The 5310 completely addresses this issue by fully mechanizing the Z-axis through an automatic control motor. This mechanism ensures that every downward cycle of the bonding head generates a precisely repeatable pressure and ultrasonic energy, providing uniform and stable results even after many years of continuous operation.

Another limitation of conventional lab equipment is the complex parameter setup process and the difficulty in storing documentation. The single-board computer hardware system running the company's intelligent management software allows for the storage of all welding parameters (force, time, ultrasonic power) as well as the configuration of wire loop shapes and individual welds directly onto the internal hard drive.

The programming interface is simplified through a color display combined with a rotary selection knob integrated with a confirmation button. As a result, operators only need minimal training to set up complex welding tasks, helping to optimize operating costs and production deployment time.

Integration and Expansion Capability

Part of the 53xx Series product line, the hardware configuration of the 5310 allows for the built-in integration of a temperature control system for the welding sample through a heating controller (integrated within the machine with a wide adjustable temperature range from 0 to 250 °C.

The workholder system has high flexibility to accommodate various component structures:

Standard fixture: Uses a robust mechanical clamping mechanism with a base plate diameter of Ø80 mm.

Optional workholder: Expands the mounting space for large components up to 4 × 4" (4 × 4 inches), integrating both mechanical clamping and vacuum suction to hold the sample using negative pressure.