Main features
- The electron beam lithography system (EBL) ELS-BODEN Series is optimized for ultra-fine patterning applications.
- The device features a writing area of up to 300 mm², flexible from small size samples, 9-inch masks to 300 mm wafers.
- The operating process is seamlessly automated thanks to the automatic sample loading system.
- The device provides a range of optional acceleration voltages: 50, 100, 125, and 150 kV.
Detail Description
8” and 12” segment configuration The world's first EBL system integrated with comprehensive exposure capabilities on 12-inch wafers. Supports a variety of sample sizes: from small sample pieces (in R&D), wafers with diameters of 2, 3, 4, 5, 6, 7, 8, 12 inches, to standard mask blanks 6025 and 9025.
The automatic sample loading mechanism provides 3 flexible sample loading configurations according to needs: Single autoloader optimized for R&D applications; Multi autoloader for small/medium scale production; and Robot loader.
The visual control software The specialized software "elms" is pre-integrated as a standard. The interface is designed with an independent modular structure for each function: CAD data conversion, beam adjustment, exposure, and SEM observation; helping to optimize the workflow. The system integrates account management features that support access rights for each user.