Key features
- Provides sub-micron resolution 3D imaging in just a few minutes, an advanced tool in failure analysis and packaging for the semiconductor industry.
- Images with a spatial resolution of 0.5 microns anywhere on samples up to 300 mm in diameter.
- Flexible analysis of industrial components and large material samples.
- No beam hardening artifacts.
- Intelligent data processing software automates the imaging process, simplifying complex operational tasks.
Detailed description
Synchronized data collection
The data collection time is independent of the sample size when using Apex XCT. Unlike traditional CT systems, where larger samples correspond to longer measurement times, the unique geometric structure of Apex XCT maintains high throughput even when the sample size is very large, such as printed circuit boards, motherboards, and thin slices. Whole board scans at high resolution (8 microns/voxel) can be stitched together for reverse engineering applications. The set below shows 20 sets stitched together with each scan taking only 36 minutes.
Objective contrast
Apex XCT eliminates noise affecting performance like conventional 3D X-ray systems. Comparing the same area captured by Apex XCT (Left) and conventional XRM/microCT (Right) – the Apex XCT results show significantly improved image quality while greatly reducing scan time.