The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.