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Ceramics & Glass
Chemical Vapor Deposition (CVD)
Plasma Enhanced Chemical Vapour Deposition Model PlasmaPro 80/100/800

The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

Electron Microscopy (SEM & TEM)
Field Emission Scanning Electron Microscopy FESEM | SEM5000Pro
The CIQTEK SEM5000Pro uses advanced Super-Tunnel electronic optical technology to create a beam path without intersection points and employs a combination of electrostatic and electromagnetic lens design. These improvements help reduce space charge effects, minimize lens aberration, and achieve a resolution of 1.2 nm at 1 kV, providing a solution for direct observation of non-conductive or semiconductor samples.
Physical Vapor Deposition (PVD)
Thin Film Deposition System NANO 36
NANO 36 is a highly optimized basic thin film deposition device from Kurt J. Lesker. This device is designed to provide a cost-effective solution while ensuring superior component quality, high performance, and a compact installation area.
Atomic Force Microscopy (AFM)
Atomic Force Microscopy Jupiter XR

Jupiter XR is a large sample AFM that integrates both high-speed scanning and an extended scan range in a single probe (XR scanner). The proprietary blueDrive™ Tapping Mode technology simplifies operation, increases repeatability, and extends probe lifespan. The laser and detector system is fully controlled by software. An ideal solution for industrial measurement, material R&D, semiconductors, polymers and diverse research.

Physical Vapor Deposition (PVD)
Thin Film Deposition System AXXIS
AXXIS is a versatile PVD thin film deposition system designed for research and development (R&D) activities that require various coating techniques on the same equipment. The system allows for the combination of Magnetron sputtering, thermal evaporation, and electron beam evaporation while supporting co-deposition to create multi-component films or complex alloys.
Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 200

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

3D X-ray Microscopy (XRM)
XRF Microscope AttoMap-200
MicroXRF laboratory achieves the highest resolution with a micron-sized unit (3-5 µm) using high-resolution optics. Sensitivity below ppm for quantification down to parts per million (ppm). Along with Sigray's flexible software packages for energy tuning, maximizing throughput and sensitivity with up to 5 different angled X-ray spectra.  
Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 75
The new generation PRO Line PVD 75 thin film deposition system with the capability to handle samples up to 6 inches. The device optimizes ideal base pressure, increases vacuum pumping speed, and supports multiple techniques (Sputtering, E-beam, Thermal). This is a flexible, reliable R&D solution for semiconductor, OLED, and optical technology.
3D X-ray Microscopy (XRM)
TriLambda-30 X-ray Microscope

TriLambdaXRM-30 (nanoXRM) utilizes Sigray's proprietary X-ray optics technology to provide cutting-edge resolution of 35nm. The device integrates up to 3 X-ray energy sources simultaneously to optimize the 3D nanoXRM image contrast for all types of materials from polymers to metals, providing a perfect non-destructive sample solution for batteries and biology.

Physical Vapor Deposition (PVD)
UHV Thin Film Deposition System LAB Line

The Lab Line system represents a technological breakthrough in the fabrication of thin films in the semiconductor research sector and advanced optoelectronic components. The core mechanism of the system is based on establishing and maintaining a stringent ultra-high vacuum (UHV) environment before and throughout the magnetron sputtering process.

Physical Vapor Deposition (PVD)
Physical Vapor Deposition Batch In-Line KDF

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

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