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Metals & Alloys
Synthesis & Fabrication
Ion Beam Etching/Sputtering System Elionix 200ERP

EIS-200ERP (Elionix Ion Beam Etching/Sputtering System): This is an ion beam etching/sputtering system capable of nano-level material etching and deposition utilizing an ECR (Electron Cyclotron Resonance) ion beam.

 

Chemical Vapor Deposition (CVD)
Plasma Enhanced Chemical Vapour Deposition Model PlasmaPro 80/100/800

The PlasmaPro series from Oxford Instruments provides flexible plasma processing platforms from R&D to high-volume production, including RIE, ICP, ICP CVD, PECVD, and combined RIE/PE technologies. It supports wafers from small pieces to 300mm, controls film stress with dual frequency (LF/HF), and detects endpoint using OES/laser. An optimal solution for MEMS, sensors, optics, LEDs, power microelectronics, and failure analysis.

Synthesis & Fabrication
Electron Beam Lithography System ELS-ORCA
Designing a square lattice with full connectivity, supporting surface-code error correction. Supporting complex quantum algorithms such as QAOA (Quantum Approximate Optimization Algorithm)..
Electron Microscopy (SEM & TEM)
Field Emission Scanning Electron Microscopy FESEM | SEM5000Pro
The CIQTEK SEM5000Pro uses advanced Super-Tunnel electronic optical technology to create a beam path without intersection points and employs a combination of electrostatic and electromagnetic lens design. These improvements help reduce space charge effects, minimize lens aberration, and achieve a resolution of 1.2 nm at 1 kV, providing a solution for direct observation of non-conductive or semiconductor samples.
Electron Microscopy (SEM & TEM)
Tabletop Scanning Electron Microscope - NANOS

NANOS is designed to be compact and modern, providing high-resolution imaging capabilities (< 8nm) and rapid high-quality elemental analysis with a magnification of 200,000x. NANOS becomes the ideal solution for research, industrial, and environmental applications.

Physical Vapor Deposition (PVD)
Thin Film Deposition System NANO 36
NANO 36 is a highly optimized basic thin film deposition device from Kurt J. Lesker. This device is designed to provide a cost-effective solution while ensuring superior component quality, high performance, and a compact installation area.
Atomic Force Microscopy (AFM)
Atomic Force Microscopy Jupiter XR

Jupiter XR is a large sample AFM that integrates both high-speed scanning and an extended scan range in a single probe (XR scanner). The proprietary blueDrive™ Tapping Mode technology simplifies operation, increases repeatability, and extends probe lifespan. The laser and detector system is fully controlled by software. An ideal solution for industrial measurement, material R&D, semiconductors, polymers and diverse research.

Physical Vapor Deposition (PVD)
Thin Film Deposition System AXXIS
AXXIS is a versatile PVD thin film deposition system designed for research and development (R&D) activities that require various coating techniques on the same equipment. The system allows for the combination of Magnetron sputtering, thermal evaporation, and electron beam evaporation while supporting co-deposition to create multi-component films or complex alloys.
Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 200

The PRO Line PVD 200 system elevates research productivity with its capability to process large wafers up to 8 inches. The system serves as a perfect solution to shorten your experimental turnaround time, delivering absolutely uniform thin-film deposition for future industrial applications.

3D X-ray Microscopy (XRM)
XRF Microscope AttoMap-200
MicroXRF laboratory achieves the highest resolution with a micron-sized unit (3-5 µm) using high-resolution optics. Sensitivity below ppm for quantification down to parts per million (ppm). Along with Sigray's flexible software packages for energy tuning, maximizing throughput and sensitivity with up to 5 different angled X-ray spectra.  
Physical Vapor Deposition (PVD)
Thin Film Deposition System PRO Line PVD 75
The new generation PRO Line PVD 75 thin film deposition system with the capability to handle samples up to 6 inches. The device optimizes ideal base pressure, increases vacuum pumping speed, and supports multiple techniques (Sputtering, E-beam, Thermal). This is a flexible, reliable R&D solution for semiconductor, OLED, and optical technology.
Secondary Ion Mass Spectrometry (SIMS)
SIMS 7f-Auto Secondary Ion Mass Spectrometer

Equipped with dual magnetic convergence SIMS technology, the IMS 7f-Auto secondary ion mass spectrometer provides excellent depth resolution with a detection limit of ppb. This is a fully automated analytical solution that delivers high throughput for the semiconductor, optoelectronics, and materials industries, maximizing productivity with continuous operation 24/7.

X-ray Absorption Spectroscopy (XAS)
X-ray Absorption Spectroscopy (XAS) QuantumLeap-H2000

QuantumLeap is an advanced X-ray Absorption Spectroscopy (XAS) system featuring dual transmission and fluorescence modes. The system offers a wide energy range from 4.5 to 25 keV and stands as the only laboratory-scale XAS that delivers synchrotron-equivalent performance directly to your lab, providing solutions for batteries and solar cells, catalysis, and heavy element research.

Secondary Ion Mass Spectrometry (SIMS)
Secondary Ion Mass Spectrometry (SIMS) - ACTINIS

Developed from the renowned IMS 7f platform, the secondary ion mass spectrometry (SIMS) with ACTINIS casing features an advanced radiation protection system, allowing for the measurement of radioactive samples up to 2 Gy/h. The device achieves sub-micron spatial resolution, optimizing transmission and the ability to measure isotope ratios. This is a safe automation solution, ideal for optimizing the nuclear fuel cycle and waste management.

X-ray Absorption Spectroscopy (XAS)
X-ray absorption spectroscopy (XAS) QuantumLeap-V210

The first XAS system capable of analyzing low atomic number samples and micro-point analysis. Allows XANES measurements at 0.7 eV and EXAFS within seconds or minutes. MicroXAS with a spot size of 100 microns with an automated sample stage allows XAS mapping at a resolution of 100 µm on a sample. It is the leading solution for battery research, catalysis, and materials science.

3D X-ray Microscopy (XRM)
TriLambda-30 X-ray Microscope

TriLambdaXRM-30 (nanoXRM) utilizes Sigray's proprietary X-ray optics technology to provide cutting-edge resolution of 35nm. The device integrates up to 3 X-ray energy sources simultaneously to optimize the 3D nanoXRM image contrast for all types of materials from polymers to metals, providing a perfect non-destructive sample solution for batteries and biology.

Electron Microscopy (SEM & TEM)
Scanning electron microscope - Focused Ion Beam DB550
FIB-SEM|DB550 integrated with electron optical technology SuperTunnel breakthrough with Gallium ion beam (Ga⁺ liquid metal ion source), providing a resolution of 3nm and sharp images. The device helps optimize the analysis and sample preparation process TEM specimen preparation, perfectly applicable for the semiconductor (semiconductor) field and materials science.
Probe Stations & Testing
Nanoindentation Tester ENT-5

The nano hardness measurement system provides high data reproducibility by minimizing environmental noise effects during measurement. Test load: 0.5 µN ~ 2 N. Simple operation and high data reproducibility. 


Physical Vapor Deposition (PVD)
Physical Vapor Deposition Batch In-Line KDF

KDF In-Line PVD Solutions (part of the Kurt J. Lesker group) is a line of advanced batch in-line thin film sputtering equipment, boasting superior mechanical reliability and the lowest cost of ownership (CoO) in the industry. Unlike bulky cluster tools, the continuous lane structure of KDF optimizes space, simplifies operation and maintenance processes, while providing a leap in coating uniformity, output yield, and process stability. The system is designed flexibly, perfectly meeting the needs from research and development (R&D) scale to large-scale industrial production in the fields of semiconductors, new materials, medical devices, and flat panel displays.

Atomic Layer Deposition (ALD)
Atomic Layer Deposition System ALD-150LX

The ALD-150LX is Kurt J. Lesker's leading solution for atomic layer deposition (ALD), allowing for the fabrication of uniform thin films at the atomic level. The system integrates proprietary technologies such as the Precursor Focusing Technique™ (PFT) and ultrahigh purity (UHP) processing capabilities, providing high performance and flexibility for the laboratory.

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