The AWB 04 wafer bonding and alignment machine provides a comprehensive adhesive bonding control process in a single chamber (in-situ), achieving superior alignment accuracy of 1 µm and a pressing force of up to 40 kN. The device features high flexibility, a compact design that optimizes space, making it an ideal solution for applications ranging from research and development (R&D) to high-performance production for 3", 4", 6" semiconductor wafers and custom chips.

The AWB 08 wafer welding and alignment machine is specialized for sizes 6" and 8". The device integrates a 1 µm precision alignment and welding process in a vacuum chamber, with a compression force of up to 40 kN. This is the ideal solution for advanced MEMS applications, 3D packaging, and high-performance experimental production at industrial standard laboratory scale.