The ACCµRA100 uses semi-automatic robotic axis technology, achieving superior post-weld accuracy of ± 0.5 µm and a large pressing force of 1-1000 N. The device provides high repeatability, optimal cost, and is an ideal solution for research (R&D) and diverse applications such as Flip-Chip, Die attach, MEMS, 3D Packaging.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics.