The ACCµRA100 uses semi-automatic robotic axis technology, achieving superior post-weld accuracy of ± 0.5 µm and a large pressing force of 1-1000 N. The device provides high repeatability, optimal cost, and is an ideal solution for research (R&D) and diverse applications such as Flip-Chip, Die attach, MEMS, 3D Packaging.

The FC300 integrates absolute parallel alignment technology within a range of 1 µrad, achieving high post-weld accuracy of ± 0.3 µm and an extremely wide force range of 1-4000 N. The device provides superior repeatability and flexible configuration capabilities from R&D to pilot production lines. The system is designed for advanced applications in ultra-fine structure component packaging (< 10 µm), 3D Integration, X-Ray/Infrared imaging sensors, MicroLEDs display, and Silicon Photonics.

ACCµRA OPTO possesses robotic axis technology combined with an extremely low force range of 0.2 - 10 N. The device achieves post-weld accuracy of ± 0.5 µm, providing high process repeatability and excellent flexibility. This is the optimal solution for specialized applications such as Optoelectronics and Silicon Photonics. 

ACCµRA M uses manual operation technology combined with a high-precision mechanical support system, achieving a post-soldering accuracy of ± 3 µm and a maximum compression force range of 100 N. The device provides absolute flexibility, operates intuitively and easily with the most optimal investment cost, making it an ideal solution for educational purposes, initial process testing, and basic R&D applications.