Manual Flip Chip Bonder ACCµRA M SET SAS

Main features

Most cost-effective solution (Cost-effective solution): Provides chip packaging capability with a low initial investment budget, suitable for all laboratory sizes.

Stable high accuracy (± 3 µm accuracy): Ensures solid and precise electromechanical bonding quality for standard microchip components.

Intuitive, easy manual operation (Easy to use): User-friendly design, simple operation helps users quickly familiarize themselves without complex training.

Outstanding process flexibility (High flexibility): Allows quick configuration changes, chip swapping, and parameter customization to conduct various types of experiments.

High repeatability thanks to mechanical support structure: Skillfully combines manual gripping and stops, mechanical measuring tools to maintain consistency between soldering cycles.

Extremely compact size: Maximizes space savings, easily arranged on a work desk in the laboratory or clean room.

Detailed description

Technology & Operating principle

ACCµRA M operates entirely in manual mode. The operating principle is based on the operator using a visual microscope system combined with a precise mechanical displacement mechanism to align the coordinates (X, Y, Z, and rotation angle Theta) between the chip and the wafer base. The device uses a direct heating control system and distributes the compressive force through a mechanical lever to perform standard chip flip bonding processes such as Thermocompression or using adhesives.

Universities, educational institutions, or newly established R&D departments often face significant challenges when needing an accurate chip bonding machine for teaching or testing ideas, but the budget does not allow access to expensive and complex automated systems. ACCµRA M thoroughly addresses this barrier by eliminating complex automated motor control systems to optimize costs while still maintaining the high precision sub-micron mechanical structure of SET, enabling users to achieve an accuracy of ± 3 µm easily and reliably.

Integration & expansion:

The device is designed as a flexible open manual platform. The machine supports processing various component sizes from small chips to common substrate panels. The system supports the integration of basic heating modules for both the chip holder (upper tool) and the wafer base support (lower chuck), combined with a compressive force range of up to 100 N, comprehensively serving basic research applications such as Die attach, preliminary Flip-chip bonding, and practical training in microchip lithography.