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Flip-Chip Bonder SET ACCµRA100

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Ion Beam Etching/Sputtering System Elionix 200ERP
Ion Beam Etching/Sputtering System Elionix 200ERP

Flip-Chip Bonder SET ACCµRA100

The ACCµRA100 uses semi-automatic robotic axis technology, achieving superior post-weld accuracy of ± 0.5 µm and a large pressing force of 1-1000 N. The device provides high repeatability, optimal cost, and is an ideal solution for research (R&D) and diverse applications such as Flip-Chip, Die attach, MEMS, 3D Packaging.

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  • Brand - SET-SAS
  • Field of Study
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SET-SAS
SET-SAS

Manufacturer of Flip-Chip bonding equipment for the highest precision in the world

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Key featuresDetailed description

Key features

Accuracy ±0.5 µm: Ensures ultra-precise alignment for advanced microelectronic and optoelectronic components.

High flexibility: Optimized for various applications, allowing easy configuration changes and testing parameters.

User-friendly, accessible design: Simplifies operation and maintenance processes, enabling users to quickly master the equipment.

Cost-effective investment: Delivers the performance of high-end industrial machines at a budget-friendly price for R&D.

Optimized for universities and research institutes: Perfectly suited for intensive research environments, prototyping, and small-scale production.

Detailed description

Technology & Operating Principles

The ACCµRA100 is a flip chip bonder that uses high-resolution optical alignment technology and a digital force/temperature control system. The machine presses the chip surfaces containing bumps directly onto the substrate with extremely high mechanical precision, achieving an error margin of ±0.5 µm.

Research institutes and labs often face difficulties when choosing between: a low-cost manual soldering machine with poor accuracy, or a high-precision industrial machine that is expensive and overly complex to operate. The ACCµRA100 completely addresses this issue. The machine provides optimal accuracy of industrial equipment but features an intuitive, accessible interface and a very reasonable price for R&D budgets.

Integration & Expansion

The device has a flexible structure, allowing users to easily upgrade or integrate additional functional modules according to research needs such as: thermo-compression, ultrasonic soldering, or conductive adhesives (ACA/ICA). The machine is well compatible with various chip sizes and substrate materials, from optoelectronic components to micro-electromechanical systems (MEMS).

Detailed Technical SpecificationsAdditional parameters

Detailed Technical Specifications

Specification

Value

Post-soldering accuracy

± 0.5 µm

Soldering force

1 N ~ 1,000 N (High force)

Heating temperature

Room Temperature (RT) ~ 400 ºC

Supported chip sizes

1 mm x 1 mm ~ 50 mm x 50 mm

Wafer substrate sizes

1 mm x 1 mm ~ 100 mm x 100 mm

Core soldering processes

Thermocompression, Reflow, UV Curing, Thermosonic

Compatible materials

Au, Au/Sn, In, Cu, Cu/Sn, Adhesives (Conductive adhesive/substrate)

Operating mode

Semi-automatic with mechanical axis

Application segment

University & Research Institute

Additional parameters

ParametersValue
Installation area (Footprint)900 × 1300 mm
Height2080 mm
Weight~ 600 kg
Field of Study Materials Sciences or Semiconductor Technology or Quantum Technology or Solar & Lithium Batteries
Brand SET-SAS
SET - ACCμRA100_datasheet.pdf
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Flip-Chip Bonder SET ACCµRA100
Flip-Chip Bonder SET ACCµRA100
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